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WO/2024/099997A1 |
The present invention relates to a rotary cutting tool insert comprising a carrier body made of maraging steel and at least one cutting element comprises at least one cutting edge. The rotary cutting tool insert further comprises a braze...
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WO/2024/099439A1 |
The present invention provides a through hole reflow soldering method. The through hole reflow soldering method comprises: placing multiple parts to be soldered on multiple bearing positions of a through hole reflow soldering device; per...
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WO/2024/097588A1 |
The present application discloses an oxygen concentration detection system for detecting the oxygen concentration in a furnace chamber of a reflow oven, comprising: a cooling device, a filter device, and a detection device. The oxygen co...
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WO/2024/094458A1 |
The invention concerns a method of turbine blade repair in which a damaged region (Di) is machined away (Rz) and repaired with a directed energy deposition process before being machined to a desired and predetermined aerodynamic profile.
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WO/2024/093455A1 |
A pipeline integration module, an air conditioner outdoor unit, and a method for preparing the pipeline integration module. The pipeline integration module comprises a first plate-like part, a second plate-like part, and a sandwich layer...
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WO/2024/094370A1 |
Disclosed is a component having features attached to it by brazing with the component being subsequently provided with a protective coating using a CVD process. The body of the component may be made of metal and fabricated using an addit...
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WO/2024/094381A1 |
The invention relates to a heat exchanger module (22) for removably arranging on a soldering system, in particular a reflow soldering system, and comprising a nonwoven filter (70). The invention further relates to a soldering system comp...
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WO/2024/087723A1 |
A pressing device (160) for ribbons (150), a series welding machine (100), and a method for welding the ribbons (150) and battery sheets (140). The pressing device (160) comprises: a pressing plate (161); a plurality of pressing needle g...
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WO/2024/060527A9 |
The present application relates to the technical field of nuclear fuels. Embodiments of the present application provide a silicon carbide composite connecting device (100) configured to connect a cladding tube (210) and two end plugs (22...
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WO/2024/084777A1 |
The present invention addresses the problem of providing: a novel brazing material which is a molded body; and a method for improving a brazing treatment for a finned tube type heat exchanger using the brazing material. A metal powder pr...
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WO/2024/081193A1 |
The present application relates to a method of making a heat exchanger (10) that includes providing a plurality of tubes (46). Each of the plurality of tubes (46) has exterior cladding on an exterior surface, interior cladding on an inte...
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WO/2024/075931A1 |
This heat exchanger comprises: a heat exchange fin; a refrigerant pipe which passes through the heat exchange fin and has a first thickness; a connecting member which is coupled to the refrigerant pipe; and a distribution pipe which is c...
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WO/2024/073174A1 |
The present application discloses an oven that comprises a lower housing assembly, an upper housing assembly, and a retaining assembly. The upper housing assembly is disposed above the lower housing assembly, the upper housing assembly i...
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WO/2024/070628A1 |
A bonded structure which comprises a first conductive member, a second conductive member, and a solder bonding part for bonding the first conductive member and the second conductive member to each other, wherein at least one of the first...
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WO/2024/073190A1 |
The present application provides a reflow oven (100). The reflow oven (100) comprises a furnace (101) and a gas pipeline assembly (104, 106). The furnace (101) comprises a plurality of furnace chambers Li (i = 1, 2,..., n). The gas pipel...
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WO/2024/061818A1 |
The present disclosure relates to a method for assembling a plate package of a plate and fin heat exchanger (1) comprising a plurality of flat plates (4, 4´) and a plurality of fin plates (3), wherein each flat plate (4, 4´) comprises ...
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WO/2024/062917A1 |
An automatic brazing device (100) comprises: a workpiece heating part that heats a brazing site of a workpiece W; a workpiece heating movement part that moves the workpiece heating part relative to the brazing site; a nozzle (40) through...
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WO/2024/064813A2 |
In some aspects, a device includes a substrate. A first metallization arranged on the substrate. A second metallization arranged on the substrate. A circuit arranged on the substrate and electrically connected to the first metallization ...
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WO/2024/056572A1 |
The invention relates to a method for connecting a sensor assembly arranged on a mounting plate to a device under test, with said method comprising the steps of (100) providing - a device under test, - a sensor assembly having a strain g...
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WO/2024/056574A1 |
The invention relates to a method for connecting a sensor assembly to a measurement object, the method comprising the following steps: (100) providing •- a measurement object, •- a sensor assembly, comprising a strain gauge, which is...
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WO/2024/056573A1 |
The invention relates to a method for connecting a sensor assembly, arranged on a mounting plate, to a measurement object, comprising the following steps: (100) providing • - a measurement object, • - a sensor assembly, comprising a ...
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WO/2024/056571A1 |
The invention relates to a method for connecting a sensor assembly (5), arranged on a mounting plate (17), to a measurement object (2), the method comprising the following steps: (100) providing - a measurement object (2), - a sensor ass...
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WO/2024/051076A1 |
A ceramic joining device, comprising a working furnace (100), a clamping mechanism (130), a vacuum interface (140), and a heater (150). A furnace cavity (111) is formed in the working furnace (100) and is used for accommodating a target ...
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WO/2024/053317A1 |
Provided is a finless heat exchanger in which a heat transfer pipe and a connecting pipe are bonded together without forming a flared diametrically expanded portion. The finless heat exchanger comprises a heat transfer pipe 20 which exte...
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WO/2024/052655A1 |
A method of manufacturing a component (5) for use in a high temperature environment, the method comprises the sequential steps of: i) providing a first substrate (10) comprising a body having a surface, ii) securing a bonding material (1...
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WO/2024/054076A1 |
A camera module according to an embodiment comprises: a lens driving device including an accommodation space; and a lens barrel disposed in the accommodation space of the lens driving device, wherein the lens barrel includes a first coup...
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WO/2024/048723A1 |
The present invention is an aluminum alloy brazing sheet comprising a core material, a brazing material, and a sacrificial positive electrode material. The core material is composed of an aluminum alloy containing, in terms of mass%, 1.3...
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WO/2024/048371A1 |
This semiconductor device constituting an upper-lower arm circuit for one phase comprises joint portions (80, 81) connected through a solder (104). Each of a plurality of solders electrically connected to the main electrode of a semicond...
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WO/2024/048642A1 |
This brazing device (100) comprises: a stage (10) that supports an assembly (AS) in which a brazing material (120) is interposed between bonding surfaces (130) of a plurality of members to be bonded (110); a pressing jig (20) that presse...
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WO/2024/042291A1 |
A method for manufacturing a part (20) comprising a formation of successive metal layers (201…20n), which are stacked on one another, each layer being formed by depositing a filler metal (15, 25), energy being supplied to the filler me...
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WO/2024/042772A1 |
Provided is a manufacturing method for a heat exchanger (1) that includes a plurality of fins (10) arranged in the thickness direction and a plurality of heat exchanger pipes (30) that pass through the plurality of fins (10), the heat ex...
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WO/2024/044086A1 |
The present application provides a reflow oven, comprising a heating zone (110), a cooling zone (120), a barrier exhaust zone (130), a fluid channel (115), a diversion device (170), a detection device (111), and a regulation device (112)...
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WO/2024/040987A1 |
Disclosed are a busbar-free solar photovoltaic module and a manufacturing method therefor, relating to the technical field of solar photovoltaic equipment manufacturing. In the present invention, cells are connected by using metal connec...
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WO/2024/033037A1 |
The invention relates to a method for connecting a strain gauge (1) to a measurement object (2), the method comprising the following steps: (100) providing - a measurement object (2), - a strain gauge (1), which is designed to at least d...
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WO/2024/028552A1 |
This method for manufacturing a plate comprising ducts for a heat exchanger is characterized in that it comprises the following steps: - applying an anti-diffusion material (step 30) to a first metal sheet at places on the first metal sh...
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WO/2024/026436A1 |
A selective soldering machine configured to adjust a solder wave provided by a selective soldering nozzle based on at least one property detected by an image sensor of the selective soldering machine. The selective soldering nozzle may b...
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WO/2024/022669A1 |
The invention relates to a method for melting a solder material for joining and/or releasing a soldered joint, wherein nanoparticles incorporated in the solder material dissipate magnetic energy from an alternating magnetic field, substa...
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WO/2024/016408A1 |
A vapor chamber cavity sealing process and a vapor chamber. The cavity sealing process comprises: providing a bottom cover (1) having a recess (11), a cover plate (2), and a capillary structure (3); placing the capillary structure (3) be...
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WO/2024/020313A1 |
The present application discloses a processing furnace comprising a furnace chamber; at least one infrared temperature measurement device; at least one calibration device comprising a black body module connected to the detection field of...
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WO/2024/020289A1 |
The present application provides a reflow oven support assembly, comprising a fixture (301), a support rod (302) and an adjustment device (303), the fixture (301) being connected to one of the upper furnace chamber housing (101) and lowe...
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WO/2024/011766A1 |
A brazed joint, brazing method and device for promoting brazing filler metal flow and deformation and gas escape. The brazed joint comprises a first base material (100), a second base material (200) and a brazing seam (300). The brazing ...
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WO/2024/011014A1 |
The present application discloses a reflow oven (100) including: a oven chamber (110); a conveying belt (217) for carrying a circuit board (108); a drive device (216) configured to drive the conveying belt (217) to travel along the conve...
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WO/2024/007453A1 |
A method for reducing residual stress of a heterogeneous brazed joint. When the temperature of the brazed joint is reduced to a certain temperature, heating treatment is performed to generate micro-plastic deformation and micro-precipita...
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WO/2024/011246A1 |
Additive particles are introduced to a braze joint by combining the additive particles with a flux and using the flux with additive particles to form a core or coating of a braze product including braze alloy and flux. Additive particles...
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WO/2024/005198A1 |
This joined body comprises an insulation member that includes a ceramic, and a retaining member that surrounds the insulation member and has an enlarged-diameter part in which the inside diameter is enlarged. The joined body also has a c...
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WO/2024/006640A1 |
The present application relates to an electrical control cabinet and a reflow oven. The electrical control cabinet includes a housing and a door assembly. The housing defines a cavity and an opening in communication with the cavity. The ...
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WO/2024/002691A1 |
The invention relates to a device (01) for establishing a contact connection between at least one connection contact (18) of a substrate (04) and at least one connection contact (19) of a semiconductor component (03), wherein a conductor...
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WO/2023/248940A1 |
A brazing structure for a vacuum container 1a is provided. The vacuum container 1a comprises: a fixed conductor 5 on which a fixed electrode 7 is supported; a movable conductor 6 on which a movable electrode 8 is supported; a flange pipe...
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WO/2023/243576A1 |
A solder removal mechanism 520 is provided to remove solder from a transport claw 510 for transporting a substrate 200 to which solder is supplied. The solder removal mechanism includes an abutment body 530 that can be passed relatively ...
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WO/2023/243575A1 |
A jet flow soldering device 100 comprises: a retention tank 110 that retains molten solder; supply ports 125, 135 for supplying the molten solder to a substrate 200; and cooling units 310, 330 that are located on the downstream side of t...
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