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WO/2001/043178A1 |
A polishing-product discharging mechanism adapted to efficiently discharge the polishing-product produced while polishing an object base plate (100) by a grinding stone (90); and a polishing device. The polishing device that is adapted t...
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WO/2001/036151A1 |
A device for sharpening a rotating discoidal cutting tool (13) is described, comprising at least one sharpening grinder (21; 23). The device provides a dressing tool (61; 71) which interacts with said at least one grinder to dress the wo...
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WO/2001/032360A1 |
A method and apparatus for controlling the conditioning of a polishing pad using noncontact ultrasonic techniques. Ultrasonic transducers (310) are employed to measure the thickness of an individual layer or layers of the polishing pad (...
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WO/2001/026862A1 |
A conditioner for polishing pad and a method for manufacturing the same are disclosed. The conditioner comprises a substrate having formed with a plurality of geometrical protrusions of a uniformed height on at least one of its sides, an...
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WO/2001/023139A1 |
A polishing pad is treated for surface conditioning by exposing a polishing surface on the pad to a chemical solvent having a solubility parameter that differs by less than about twenty percent from a solubility parameter of the material...
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WO/2001/017724A2 |
The present invention is an ultrasonic transducer slurry dispensing device (110) and method for efficiently distributing slurry. The present invention utilizes ultrasonic energy to facilitate efficient slurry application in a IC wafer fa...
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WO/2001/015865A1 |
A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body (150) having a conditioning surface that engag...
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WO/2001/012385A1 |
An improved workpiece carrier assembly (100) includes a workpiece retaining assembly (122) having a plurality of distinct retaining elements (202) rather than a one-piece retaining ring. In accordance with one embodiment, a plurality of ...
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WO/2001/007208A1 |
A polishing machine and a three-chambered polishing head (40) structure and method improve polishing uniformity near the edge of a substrate, especially planarized semiconductor wafers during chemical mechanical polishing (CMP). It provi...
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WO/2001/003886A1 |
An improved workpiece carrier retaining structure (100) includes at least one element for retaining a workpiece that is comprised of a hard ceramic material. The retaining element may take the form of a retaining ring (110) comprised of ...
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WO/2001/002133A2 |
A disc-like workpiece (10), such as a semi-conductor wafer, is positioned relative to a grooved grinding wheel (32) by the steps of rotating the workpiece and wheel about respective parallel axes, performing a preliminary grind, measurin...
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WO/2000/078504A1 |
A method and apparatus for polishing workpieces such as semiconductor wafers which includes a wafer carrier having a retaining structure (30) which functions as an in-situ conditioner for a polishing surface. The retaining structure (30)...
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WO/2000/073021A1 |
A method and a system are provided for cleaning a CMP pad. The method starts by applying chemicals onto the surface of the CMP pad. The chemicals are then allowed to react with a residue that may be on the pad to produce by-products. Nex...
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WO2000059681B1 |
According to an example embodiment, the present invention comprises a CMP pad conditioner arrangement. An inlet (130) is configured and arranged for receiving treatment elements. A distribution surface (140) is coupled to the inlet (130)...
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WO/2000/069597A1 |
A method of polishing the double sides of a plurality of works simultaneously by rotating a plurality of carriers between upper and lower rotating surface plates, comprising the steps of forming the works (400) integrally with the carrie...
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WO/2000/067949A1 |
A skate blade sharpening machine includes an adjustable full-width dressing wheel (75) rotated by a separate electric motor (77) against the grinding wheel (13) of the skate sharpening machine.
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WO/2000/059644A1 |
A system, and method are disclosed for preparing platens (114) to perform lapping operations. The system includes a platter (120) that is rotatably mounted on a base (110), and designed to receive the platen thereon. A main drive motor (...
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WO/2000/060645A2 |
According to an example embodiment, the present invention is directed to a CMP polishing apparatus (100) having at least two conditioning arms (110+120) for use in conditioning a polishing pad (150). The CMP polishing apparatus includes ...
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WO/2000/058053A1 |
A pad shaping tool (10) for shaping a polishing pad (36). The tool includes a disk (12) having a first side (14) and a second side (16) and at least two discontinuous pad shaping surfaces (18) located in spaced apart positions relative t...
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WO/2000/056502A1 |
A lapping machine for lapping a work while adequately correcting the warp of the work. A lapping method and a method of fabricating a magnetic head slider by using the lapping method are also disclosed. The lapping machine comprises a la...
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WO/2000/053370A2 |
A method and apparatus for resurfacing a polishing pad using non-abrasive techniques. These techniques include shaving, milling, or planing the upper working surface of the polishing pad using an edged cutting tool to alter the microtext...
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WO/2000/051783A1 |
A method of conditioning pads (2) used in the polishing of semiconductor wafers containing copper circuitry. The method includes applying a treatment solution that contains a reactant for particulate copper-containing debris on the pad (...
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WO/2000/043154A1 |
An improved process for producing an endodontic instrument (38) with a predetermined taper (80) having a plurality of flutes (94, 95, 96), each with a predetermined number of spirals over a predetermined length of the instrument are prov...
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WO/2000/040369A1 |
Machine (10) for machining an envelope surface of a cylindrical work piece (28) including a tubular cylindrical housing (13) with longitudinal axis and having an inner space (14) extending from a first end of the housing, and with an axi...
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WO/2000/037217A1 |
A method of cleaning an abrasive surface, such as a polishing pad in a chemical-mechanical-polishing apparatus, includes the application of an acidic cleaning solution to the abrasive surface, while applying an abrasive force to the abra...
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WO/2000/027585A1 |
A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be passively rotated...
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WO/2000/024548A1 |
The surface of a grindstone is dressed by constant cutting depth processing, preventing the surface of the grindstone from cracking, which might cause scratches, and dressing the dresser. The planarity of the surface of the dresser can b...
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WO/2000/018543A1 |
The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one...
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WO/2000/018542A1 |
A conditioner head uses a fluid purge system to prevent debris from entering openings in the conditioner head and causing deterioration of bearings and other moving components in the conditioner head. The fluid may be a gas, such as nitr...
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WO/2000/013870A1 |
A device for cutting and mirror finishing a single crystal SiC comprising a metal bonded wheel (10) consisting of a flat sheet portion (10a) rotating on the axis Z and a taper portion (10b) provided on the outer side of the flat sheet po...
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WO/2000/009291A1 |
A method of dressing a grinding wheel (G) by advancing a dressing tool (R) across the surfaces to be dressed, the method comprising first moving the dressing tool (R) across each side portion to remove material to make the wheel (G) of p...
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WO/2000/006340A1 |
A disc-shaped, rotary dressing tool (3) has a rigid core (10) and an abrasive rim (4) around at least one surface of the periphery of the rigid core (10), the rigid core (10) and the abrasive rim (4) being oriented in a direction (7) ort...
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WO/1999/067052A2 |
An extremely precise computer controlled grinding machine (10) having the capability to write its own computer programs for controlling the grinding machine (10) to perform individual tasks, including both grinding and dressing to severa...
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WO/1999/067054A1 |
A semi-conductor wafer (12) has its inclined edge flanks polished by a grooved wheel (16) of synthetic plastics material, while a jet (20) of polishing slurry, which may comprise colloidal silica, is fed downwards into the zone of contac...
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WO/1999/055493A1 |
A grinding wheel capable of polishing only protruded parts and having a self-stop function so that the polishing is terminated automatically when irregularities have been eliminated by the polishing and a polishing method using the grind...
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WO/1999/052677A1 |
An abrasive article includes a plurality of abrasive particles securely affixed to a substrate with a corrosion resistant matrix material. The matrix material includes a sintered corrosion resistant powder and a brazing alloy. The brazin...
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WO/1999/050023A1 |
The invention concerns a polishing machine comprising at least a base unit (10) in the form of a parallelepiped cell (12), with a first loading and unloading surface (14), a second opposite parallel surface (16) for access to the working...
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WO/1999/050024A1 |
A polishing apparatus has a turntable (20) with a polishing cloth (5) attached thereto and a top ring (3) for holding and pressing a workpiece (2) to be polished against the polishing cloth (5) under a certain pressure. The polishing app...
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WO/1999/050022A2 |
A conditioner head (60) for conditioning the polishing surface of a polishing pad. The conditioner head (60) includes a drive element carried for rotation about a longitudinal axis and a disk backing element (80). The disk backing elemen...
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WO/1999/046083A1 |
A cleaning device capable of easily and securely washing out deposit adhering to a surface plate correcting dresser (6) of a surface polishing machine, comprising an air nozzle (15) for bubbling, a first lower surface brush (18) in conta...
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WO/1999/046063A1 |
A cleaning device extremely simple in construction and capable of securely removing reaction products remaining and used fluid deposited on a brush, wherein a chamber part (5) is provided in a main body part (4) having an upwardly open r...
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WO/1999/041039A1 |
An end effector (11a, 11b) is provided for conditioning pads used to polish semiconductor wafers. The end effector (11a, 11b) has a substrate (13) with a matrix (15) (preferably a polymer) disposed thereon. Abrasive particles such as dia...
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WO/1999/041038A1 |
An improved chemical-mechanical polishing method and apparatus (11) is provided. A brush (13a) is employed to continually brush slurry particles from surface features, e.g., grooves (19), on a polishing pad (17). In this manner slurry is...
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WO/1999/036227A1 |
Disclosed is a device for dressing a grindstone (1) to polish the running surface structure of a ski. Said device comprises a rotating drive (7) for the grindstone (1), a planing tool (2) with at least one cutting insert that can be plac...
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WO/1999/033616A1 |
A machining device using cool air cooling capable of performing the conditioning of a machining tool at an appropriate timing for a work piece, wherein, when a work piece (W) is ground while cooling air is supplied to a portion to be gro...
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WO/1999/030871A1 |
Apparatus (10) for dressing the cutting surfaces around a central opening of an annular inside diameter saw (S). The apparatus includes a base (12) and a shaft (14) mounted on the base (12) for rotation on a longitudinal axis (L) of the ...
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WO/1999/029469A1 |
An active surface (28) of a grinding wheel (26) which has electrically non-conductive abrasive grains imbedded in an electrically conductive bonding agent is arranged at a given distance (a) to an electrode (40), which is jumpered by a l...
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WO/1999/028084A1 |
A method and apparatus for polishing and planarizing workpieces such as semiconductor wafers is presented. Conditioning rings, which are used to condition polishing pads used in the planarization or polishing of semiconductor wafers, are...
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WO/1999/026763A2 |
A polishing apparatus has two parallel processing lines that enables to carry out efficient parallel processing by minimizing the idle time for the turntable and maximizing the through-put. The polishing apparatus comprises at least two ...
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WO/1999/024218A1 |
Method of manufacturing a memory disk or a semiconductor device using a polishing apparatus (100) having a substrate and a fixed abrasive pad (6), the fixed abrasive pad (6) having a three-dimensional fixed abrasive polishing layer havin...
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