| Document |
Document Title |
|
JP6371864B2 |
The present invention relates to an aqueous mixed binder composition and a method for binding fibrous materials by using the same, and more specifically, relates to an aqueous mixed binder composition comprising a) one or more reducing s...
|
|
JP6371148B2 |
To provide an adhesive for camera module which has a sufficiently low elastic modulus after hardening, provide an adhesive for camera module which has an excellent shape holding characteristic in the application to an adhesion object, an...
|
|
JP6368366B2 |
The aqueous adhesive composition comprises an unsaturated elastomer latex and a phenol/aldehyde resin based on an aldehyde of formula (I): in which X comprises N, S or O and R represents —CHO, and based on a polyphenol comprising one o...
|
|
JP6366228B2 |
To provide an adhesive sheet which is highly reliable and excellent in the property of filling irregularities, and to provide a dicing/die-bonding film.The adhesive sheet contains a spherical alumina filler and a resin component which co...
|
|
JP6368733B2 |
To provide a composition for heat-resistant adhesive insulation coat that is suitable for producing a laminated electromagnetic steel sheet used for the applications requiring high-temperature adhesiveness such as automobile motors, and ...
|
|
JP6363098B2 |
A polymerizable composition, articles, and methods are provided, wherein the polymerizable composition includes a benzoxazine, an acid-forming peroxide catalyst and optionally a film-forming polymer, a co-catalyst, a curative, or a combi...
|
|
JP6356582B2 |
The purpose of the present invention is to provide an adhesive sheet that is possible to cure in a short period of time, reduce the poor bonding between the copper wire and the pad, and prevent from rupture of the semiconductor wafer, an...
|
|
JP6344021B2 |
|
|
JP6340909B2 |
|
|
JP6343008B2 |
A method of joining two rubber tyre portions, the method including applying a water-based adhesive compound to at least one surface of one of the two portions; and joining the two rubber portions. The water-based adhesive compound has wa...
|
|
JP6335197B2 |
The present describes wood adhesives reinforced with cellulose nanocrystals (CNC), in liquid and powder forms in which resin system are a phenol-formaldehyde polymer and/or lignin-phenol-formaldehyde polymer and polymeric methylene diphe...
|
|
JP6327550B2 |
|
|
JP2018070871A |
To provide an adhesion aid for an aqueous adhesive for woody material, which is used for an aqueous adhesive composition, having excellent adhesive strength and water resistance.An adhesion aid for an aqueous adhesive for woody material ...
|
|
JP6308340B1 |
A vulcanized adhesive composed of an organic solvent solution to which 1 to 10 parts by weight of epoxy resin and 10 to 30 parts by weight of unvulcanized NBR are added per 100 parts by weight of high ortho-type novolak phenol resin. Whe...
|
|
JP6310748B2 |
The present invention provides a die bond film. The die bond film forms a reforming area by radiating a laser beam to a line to be divided in a semiconductor wafer. After the semiconductor wafer is in a state capable of being easily divi...
|
|
JP6297158B2 |
The invention relates to a biocidal resin composition including one or a plurality of resins selected from melamine- formaldehyde, urea-formaldehyde, phenol-formaldehyde, melamine-urea-formaldehyde and phenolic resins; and more than one ...
|
|
JP2018503532A |
This application describes a method for capturing formaldehyde from a wood composite material containing urea-formaldehyde or melamine urea-formaldehyde by applying a combination of formaldehyde trapping agents to the surface layer and c...
|
|
JPWO2016159218A1 |
According to the present invention, a resol-type modified phenol resin having a structural unit A represented by the following general formula (1) modified with dimethylphenols and a structural unit B represented by the following general...
|
|
JP2018008662A |
To provide a tire having excellent adhesive strength between a reinforcement layer containing rubber and a resin tire skeleton member.A tire 10 includes: a resin tire skeleton member 12; a reinforcement layer 16 including multiple reinfo...
|
|
JP2018500218A |
To provide a complicated semi-finished product or a finished product made of rubber, for example, a reinforcing product for reinforcing an automobile tire or the like. The present invention is a reinforcing product particularly useful fo...
|
|
JP6251785B1 |
[Subject] It is warm in prevention-of-moisture mind, mildewproofing, preservation from decay, structural stability, non-aldehyde, and winter, and cool insect control and water resistance provide the manufacturing method of the good adhes...
|
|
JP6249207B2 |
|
|
JP6240659B2 |
A heat-curable structural adhesive includes at least one non-rubber-modified epoxy resin; an optional rubber or toughener, one or more epoxy curing agents, one or more epoxy curing catalysts; and a flame retardant mixture that includes (...
|
|
JP6222267B2 |
|
|
JP6222941B2 |
An object of the present invention is to provide an underfill sheet that enables suitable filling of unevenness of a circuit surface of a semiconductor element, a suitable connection of a terminal of the semiconductor element and a termi...
|
|
JP2017193690A |
To provide an adhesive film for a multilayer printed board excellent in embedding property of unevenness even when a silica filler is highly filled.An adhesive film for a multilayer printed board has a resin composition layer obtained by...
|
|
JP6220100B2 |
Disclosed is an adhesive sheet having an expandable adhesive layer 2 on one side or both sides of a base 1, wherein the base is composed of a laminate having a laminated structure in which a resin film and a non-woven fabric, or a resin ...
|
|
JP6217199B2 |
To provide a film positive photosensitive adhesive composition capable of exhibiting appropriate fluidity in connection between semiconductor chips or connection between the semiconductor chip and a support member for mounting the semico...
|
|
JP6213618B2 |
To provide a film-like adhesive agent capable of mounting a semiconductor device without a damage, in a wire embedding structure while reducing a void generated at crimping when encapsulating.A film-like adhesive agent includes: a) 100 p...
|
|
JP6211071B2 |
Adhesive film comprising at least one carrier film and two external adhesive compound layers, at least one of the adhesive compounds being a heat-activable bondable adhesive compound, with black pigments added to the heat-activable adhes...
|
|
JP2017179064A |
To provide an adhesive for electronic component hardly being flowed out during press crimping and excellent in laminating processability and solder heat resistance.There is provided an adhesive for electronic component containing (A) an ...
|
|
JP6208438B2 |
|
|
JP6205646B2 |
To provide a die bonding composite sheet excellent in stickability to a semiconductor wafer, and having high reliability when going through the history of temperature change, in which migration of epoxy resin from a film-like adhesive to...
|
|
JP2017171814A |
To provide an adhesive sheet for printed wiring board capable of being used as an adhesive agent for multilayer printed board or a coverlay film adhesive and excellent in adhesive strength, solder heat resistance after moisture absorptio...
|
|
JP2017160384A |
To provide an adhesive film for multilayer printed wiring board excellent in unevenness embedding property even when highly filled with a silica filler.An adhesive film for multilayer printed wiring board has a resin composition layer ob...
|
|
JP2017161837A |
To provide a photosensitive adhesive composition that exhibits excellent sensitivity, resolution, and thermocompression bonding.A photosensitive adhesive composition comprises (A) phenolic resin, (B) a compound that produces acid by ligh...
|
|
JP6191800B1 |
[Subject] Even if you use the slimmed-down semiconductor device, provide film adhesive and the dicing die-bonding integral-type adhesion sheet in which good connection reliability is shown. [Means for Solution] While wirebonding connecti...
|
|
JP6191799B1 |
[Subject] Even if you use a slimmed-down semiconductor device, provide a manufacturing method and film adhesive of a semiconductor device of a wire embedded model in which good connection reliability is shown, and a semiconductor device....
|
|
JP6193663B2 |
To provide a die-bonding film with dicing tape which makes possible to suppress the accumulation of an air bubbles (voids) at the boundary between a die-bonding film and an object to stick the film to after a sealing step even on conditi...
|
|
JP2017150106A |
To provide a polyester fiber cord having practically efficient adhesiveness of a fiber and a rubber while suppressing coating weight of an adhesive, which is not achieved in prior art.There are provided a polyester fiber cord coated by a...
|
|
JP6189435B2 |
Processes for the preparation of bio-based fiber gums and products produced by these processes and some of their uses.
|
|
JP6185092B2 |
This invention provides a product comprised of a substrate with a rubber composition attached to the substrate by at least one interlayer of a polysilsesquioxane composition having phosphate cross-linkages. The at least one polysilsesqui...
|
|
JP2017137433A |
To provide a technology in which a coat layer such as a coated film or a printed film can be formed on polyethylene with sufficient adhesion strength as well as polyethylene can be bonded to each other with sufficient adhesive strength a...
|
|
JP6169820B2 |
|
|
JP6166605B2 |
The invention relates to an adhesive composition and adhesive sheet which are of visibility and adhesiveness. The adhesive composition includes acrylic polymer,phenolic resin,epoxy resin and colorant. In comparison with 100 parts by mass...
|
|
JPWO2016052133A1 |
It has a base material layer (P1 layer) and an easy-adhesion layer (P2 layer) mainly composed of a polyester resin having a terminal carboxyl group amount of 25 equivalents / ton or less, and the P2 layer is the following requirement (1)...
|
|
JP6156393B2 |
Provided are: a conductive resin paste which has a low silver content and can be cured at a lower temperature in a shorter time than conventional resin pastes, while having a low resistance, high adhesion and excellent storage stability ...
|
|
JP2017515969A |
The coated steel reinforcing element includes one or more threaded reinforcing elements, each including a steel core and an adhesive layer coating at least one portion of the steel core of the above or each threaded reinforcing element. ...
|
|
JP6135202B2 |
To provide a wire-embedded semiconductor device which exhibits good connection reliability even when a thinned semiconductor element is used; and provide a manufacturing method of the semiconductor device.In a semiconductor device 200, a...
|
|
JP6136268B2 |
Provided are a die attach film, a semiconductor wafer, and a semiconductor packaging method. The die attach film can prevent generation of burrs or scattering of chips in a dicing process, and exhibits excellent expandability and pick-up...
|
