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WO/2020/261604A1 |
This free-cutting copper alloy contains Cu in the amount of 58.5-63.5%, Si in an amount greater than 0.4% and no greater than 1.0%, Pb in the amount of 0.003-0.25% and P in the amount of 0.005-0.19%, with Zn and inevitable impurities con...
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WO/2020/261636A1 |
This copper allow casting comprises, 58.5-65.0 mass% (exclusive of 58.5 and 65.0) of Cu, 0.40-1.40 mass% (exclusive of 0.40 and 1.40) of Si, 0.002-0.25 mass% (exclusive of 0.002 and 0.25) of Pb, 0.003-0.19 mass% of P (exclusive of 0.003 ...
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WO/2020/261611A1 |
This free-cutting copper alloy comprises Cu: 58.0%-65.0% exclusive, Si: 0.30%-1.30% exclusive, Pb: greater than 0.001% and less than or equal to 0.20%, Bi: greater than 0.020% and less than or equal to 0.10% and P: 0.001%-0.20% exclusive...
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WO/2020/261666A1 |
This free-cutting copper alloy contains more than 57.5% but less than 64.5% of Cu, more than 0.20% but less than 1.20% of Si, more than 0.001% but less than 0.20% of Pb, more than 0.10% but less than 1.00% of Bi and more than 0.001% but ...
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WO/2020/255836A1 |
There is provided a copper composite plate material in which: one surface of a first copper layer is pressure-welded to a second copper layer; the first copper layer is configured from a precipitation-strengthened copper alloy; and the s...
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WO/2020/246094A1 |
This palladium-coated copper bonding wire includes a core material composed mainly of copper and a palladium layer on the core material, wherein: the concentration of palladium with respect to the entire wire is 1.0-4.0 mass%; and the wo...
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WO/2020/244865A1 |
The invention relates to an electrical contact element for a connector comprising a metallic base body (111, 211) and a wear layer (113, 213) which is applied to the base body (111, 211). The wear layer (113, 213) is made from pure ruthe...
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WO/2020/244866A1 |
The invention relates to an electric contact element for a connector comprising a metallic base body (111, 211) and a wear layer (113, 213) that is applied to the base body (111, 211). The wear layer (113, 213) is made from an alloy havi...
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WO/2020/237812A1 |
Provided is an intelligent multi-section water activation purifier, comprising a shell with openings at two ends, pipe connectors mounted at the two ends of the shell, and a water activation and purification pipe. The water activation an...
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WO/2020/237943A1 |
Disclosed are a high-strength and high-conductivity copper alloy pipe and a preparation method therefor, comprising Zr, Cr, Nb, Mg, and RE, and the remainder is copper and unavoidable impurities. During preparation, once an alloy ingot i...
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WO/2020/235266A1 |
A porous body provided with a backbone having a three-dimensional net-like structure, wherein the main body of the backbone contains at least two types of metal elements selected from the group consisting of nickel, manganese, cobalt, ir...
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WO/2020/231674A1 |
A process for producing a copper-beryllium alloy product. The process comprises preparing a base alloy having 0.15 wt% - 4.0 wt% beryllium and having grains and an initial cross section area. The process further comprises cold working th...
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WO/2020/228503A1 |
A high-strength and high-conductivity Cu-Ag-Sc alloy and a preparation method therefor. The alloy comprises the following components in mass percent: 1-10% of Ag, and 0.05-0.5% of Sc, with the balance being Cu. The hardness of the alloy ...
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WO/2020/225910A1 |
A magnet composite which comprises an axial member and a magnet disposed around the axial member and containing metal and a magnetic material containing a rare earth element.
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WO/2020/214226A1 |
This disclosure provides a graded composition including at least a first, second, and third material property zone each having a crystallographic configuration distinct from other zones. In some implementations, the graded composition ha...
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WO/2020/213224A1 |
Provided are: a copper alloy sheet material which has excellent bendability while maintaining high strength, also has excellent stress corrosion cracking resistance and stress relaxation resistance properties, and is inexpensive; and a m...
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WO/2020/209175A1 |
A ceramic copper circuit board including a ceramic board, and a copper circuit provided upon the ceramic board, said ceramic copper circuit board characterized in that, in a cross section of the copper circuit parallel to a first directi...
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WO/2020/209026A1 |
Provided is a Cu-(Ni,Co)-Si alloy wire that has flexibility (Vickers hardness of 150-200 HV) suitable for crimping connector terminals, in addition to electrical conductivity, strength, and elongation. Said Cu-(Ni,Co)-Si alloy wire conta...
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WO/2020/209485A1 |
The present invention provides a Cu-Co-Si-Fe-P-based copper alloy for electronic materials, which has an improved balance among strength, electrical conductivity, and bending workability, and a method for preparing same. The Cu-Co-Si-Fe-...
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WO/2020/210444A1 |
A copper alloy that is devoid of beryllium and has a 0.2% offset yield strength of at least 70 ksi and an electrical conductivity of at least 75% IACS is disclosed. The copper alloy comprises chromium, silicon, silver, titanium, zirconiu...
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WO/2020/203576A1 |
The present invention increases the adhesiveness between a plating film for reducing the contact electrical resistance and a copper alloy plate containing Mg. Provided is a copper alloy plate containing, in a center section in a plate th...
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WO/2020/203071A1 |
Provided are: a copper material which can be prevented from the growth and non-uniformization of crystal grains even after heating; and a heat-dissipating member which comprises the copper material. The copper material has a composition ...
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WO/2020/196792A1 |
A copper alloy strip according to the present invention has an alloy composition containing 3-20 mass% of manganese with the remainder comprising copper and inevitable impurities, wherein the average value of KAM is at least 1° and less...
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WO/2020/195219A1 |
This copper alloy plate contains 0.1-0.6 mass% of Cr, and a total of 0.01-0.30 mass% of Zr and/or Ti, the remaining portion being copper and incidental impurities. Regarding the copper alloy plate, the Schmid factor as measured when tens...
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WO/2020/196791A1 |
This copper alloy bar has a composition that contains 3–20 mass% of manganese (Mn), the remainder comprising copper (Cu) and unavoidable impurities. The copper alloy bar is characterized in that the ratio (the surface layer [Mn/Cu] rat...
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WO/2020/195218A1 |
This copper alloy plate contains 0.1-0.6 mass% of Cr, and a total of 0.01-0.30 mass% of Zr and/or Ti, the remaining portion being copper and incidental impurities. Regarding this copper alloy plate, the difference between the Schmid fact...
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WO/2020/187758A1 |
The invention relates to the use of a Cu-Zn alloy of the following composition (stated as wt.%): Cu: 80 - 85, Si: 2.0 - 6.0, Al: 0.55 - 2.0, Fe: maximum 0.8, Ni: maximum 0.5, Sn: maximum 0.5, Mn: maximum 0.1, Pb: maximum 0.3, remainder Z...
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WO/2020/182846A1 |
The invention relates to a method for producing metal components, consisting at least partially of a copper alloy, comprising the following alloy components in wt.%: 0 wt.% < Sn ≤ 8 wt.%; 0 wt.% < Zn ≤ 6 wt.%; 0.1 wt.% ≤ S ≤ 0.7 ...
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WO/2020/182845A1 |
The invention relates to a method for producing components for media-guiding gas or water lines, in particular pipe or plumbing fittings for drinking water lines, consisting at least partially of a copper alloy, comprising the following ...
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WO/2020/184773A1 |
The present invention pertains to a heat-dissipating plate which can be bonded with elements formed of ceramic material during the packaging of high-power electronic devices or optical devices that generate large amounts of heat, and can...
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WO/2020/179515A1 |
The purpose is to provide a rolled copper foil for secondary battery negative electrode current collectors, whereby it becomes possible to satisfactorily prevent the plastic deformation and breakage of a copper foil which may be caused b...
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WO/2020/174880A1 |
A copper electrode material comprising Cu and unavoidable impurities, wherein the content of the unavoidable impurities is 1 ppm by mass or less and the average crystal grain diameter is 100 μm or less. A copper-containing electrode mat...
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WO/2020/170956A1 |
The present invention provides a composition characterized by containing 0.3-0.7 mass% of Cr, 0.025-0.15 mass% of Zr, 0.005-0.04 mass% of Sn, 0.005-0.03 mass% of P, and the remainder comprising Cu and inevitable impurities, wherein Vicke...
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WO/2020/162526A1 |
Provided are: a palladium-coated copper bonding wire which does not undergo the formation of shrinkage cavities during a first bonding procedure, has high bonding reliability, and can keep excellent bonding reliability steadily for a lon...
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WO/2020/162445A1 |
According to the present invention, a copper member has a composition in which the Cu purity is 99.96 mass% or more, the balance is inevitable impurities, the contained amount of P is 2 mass ppm or less, and the total contained amount of...
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WO/2020/155322A1 |
A nano dispersion copper alloy having high airtightness and low free oxygen content, and a short-process preparation technology. The compositions of the alloy comprise Al2O3, Ca, and La. The preparation technology for the alloy comprises...
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WO/2020/158684A1 |
A Cu-Al-Mn-based shape-memory alloy molded article according to the present invention has a screw part, wherein the screw part is a thread-rolled part. A method for producing a Cu-Al-Mn-based shape-memory alloy molded article according t...
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WO/2020/153834A1 |
The invention relates to a copper-zinc alloy with low lead content that is useful in the production of wire used for manufacturing cages for aquaculture, wherein said wire suffers the least possible damage due to zinc loss during the exp...
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WO/2020/151349A1 |
A lead-free dezincification-resistant copper alloy material and a valve core assembly made of same, comprising in parts by mass: 59-64 parts Cu, 36-40 parts Zn, 0.2-0.4 parts Bi and 0.05-0.2 parts As, and also comprising Pb, wherein ther...
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WO/2020/152967A1 |
A copper alloy plate material according to the present invention has an alloy composition comprising 0.3 to 2.5% by mass of Co, 0.1 to 0.7% by mass of Si and a remainder made up by Cu and unavoidable impurities. When a longitudinal secti...
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WO/2020/148685A1 |
A metal composite container 100 for storing liquid is provided herein. The container includes an outer casing 102 made from either plastic or metal or in combination to define shape of a bottle, a flask 104 placed inside the outer casing...
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WO/2020/149404A1 |
Provided is a negative electrode active material that has excellent capacity, has an excellent capacity retention ratio, and has excellent coulomb efficiency when repeatedly charged/discharged. The chemical composition of alloy particles...
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WO/2020/145397A1 |
A copper alloy material is characterized by having a composition comprising 0.15 to 0.50 mass% inclusive of Mg, 0.20 to 0.90 mass% inclusive of Cr and a remainder made up by Cu and unavoidable impurities, and also characterized by having...
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WO/2020/144913A1 |
A sputtering target material contains one or more elements selected from Ag, As, Pb, Sb, Bi, Cd, Sn, Ni and Fe in a total amount of 5 to 50 massppm inclusive, with the remainder made up by Cu and unavoidable impurities, wherein, when the...
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WO/2020/144322A1 |
The invention relates to a test needle for measurement of electrical contact connection and to a bonding wire for electrical contact connection of a chip, wherein the test needle or bonding wire has been manufactured from a foil for prod...
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WO/2020/135582A1 |
Disclosed is an aerogel-reinforced metal matrix composite material, a preparation method and an application thereof. The preparation method of the composite material comprises obtaining an aerogel; obtaining a metal as a material matrix;...
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WO/2020/136772A1 |
The invention of the present application addresses the problem of providing: a bronze alloy for casting use, which has a lead-free composition and is imparted with high seize resistance and adhesive wear resistance enough to withstand fl...
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WO/2020/136935A1 |
The invention of the present application addresses the problem of providing: a bronze alloy which has a lead-free composition and is imparted with high seize resistance and adhesive wear resistance enough to withstand fluctuating high-sp...
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WO/2020/137726A1 |
A copper alloy plate which contains, at the thickness center thereof as observed in the plate thickness direction, 0.3 to 1.2% by mass inclusive of Mg and 0.001 to 0.2% by mass inclusive of P, with the remainder made up by Cu and unavoid...
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WO/2020/133680A1 |
A method for preparing a nickel-aluminum-bronze alloy, comprising: mixing Cu, Al, Ni, Fe and Mn powders according to a ratio, melting, forging and thermally treating the powders to obtain a bar, treating the bar by using plasma electrode...
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