Title:
【発明の名称】穿孔リベット打ち結合を作る方法及び装置
Document Type and Number:
Japanese Patent JP2001523581
Kind Code:
A
Abstract:
A method as well as an apparatus manufactures a punch riveted joint, wherein at least two layers are pressed by a holding-down device against the die and a rivet, in particular a semitubular rivet, is provided for joining the layers. The holding-down device is connected by a coupling unit to the punch in such a way that during a punch riveting operation a coupling of the holding-down device to the punch may be varied between a substantially rigid coupling state and an uncoupled state.
Inventors:
Hermann Dirk
Mawell dieter
Oppel Reinhold
Mesel Joachim
Mawell dieter
Oppel Reinhold
Mesel Joachim
Application Number:
JP2000521933A
Publication Date:
November 27, 2001
Filing Date:
November 26, 1998
Export Citation:
Assignee:
M Heart Inc.
International Classes:
B21J15/00; B21J15/02; B21J15/20; B21J15/28; (IPC1-7): B21J15/00; B21J15/02; B21J15/20
Attorney, Agent or Firm:
Minoru Nakamura (9 outside)