Title:
【発明の名称】マイクロエレクトロニクス組立体のEMI遮蔽と熱制御の組合せのためのゲル構造体
Document Type and Number:
Japanese Patent JP2003502853
Kind Code:
A
Abstract:
A shielding and thermal dissipation structure for an electronic assembly including a distribution circuit and at least one electronic component mounted on a surface of the distribution circuit. A plastic housing overlays the at least one electronic component, and includes an outer periphery defining a housing interior and substantially surrounding the outer periphery of the at least one electronic component. A closed end on one side of the housing outer periphery has an interior surface facing the at least one electronic component with a metal coating about 5 microns thick on the interior surface. The metal coating is chosen from the group of nickel and gold. An electrically conductive gel in the housing interior about the plastic housing outer periphery (and preferably including carbon particles or carbon fibers) is in intimate contact with the distribution circuit and the metal coating. And a thermally conductive gel is disposed between the at least one electronic component and the housing closed end interior surface, and preferable includes particles of at least one of the group of aluminum oxide, aluminum nitride, and boron nitride.
Inventors:
McDonald's, James, Dee, Junior
Marsinky Wicks, Walter, M
Marsinky Wicks, Walter, M
Application Number:
JP2001504738A
Publication Date:
January 21, 2003
Filing Date:
June 05, 2000
Export Citation:
Assignee:
Ericsson Incorporated
International Classes:
H01L23/28; H01L23/42; H01L23/552; H05K7/20; H05K9/00; (IPC1-7): H05K9/00; H01L23/28; H05K7/20
Domestic Patent References:
| JPH07111299A | 1995-04-25 | |||
| JPH0567893A | 1993-03-19 | |||
| JPH09107190A | 1997-04-22 | |||
| JPH0832272A | 1996-02-02 | |||
| JPH10214923A | 1998-08-11 | |||
| JPH0786786A | 1995-03-31 | |||
| JPH1041678A | 1998-02-13 | |||
| JPH05235023A | 1993-09-10 | |||
| JPH0961456A | 1997-03-07 |
Attorney, Agent or Firm:
Akira Asamura (3 outside)