Title:
【発明の名称】固体コンデンサおよびそれらの製造方法
Document Type and Number:
Japanese Patent JP2003505879
Kind Code:
A
Abstract:
The present invention relates to the field of solid state capacitors. The invention particularly relates to capacitors of the type in which a powder-formed valve action material, typically tantalum, forms a highly porous anode body portion of a solid state capacitor. According to one aspect of the present invention there is provided a method of manufacturing a solid state capacitor including: providing an electrically conducting substrate; forming a plurality of upstanding porous electrically conducting anode bodies on a surface of the substrate, each body electrically connected to the substrate; forming an electrically insulating layer on the exposed surface area provided by the porous bodies; forming a conducting layer on the insulating layer; dividing the substrate into capacitor units, each having a portion of substrate provided with a porous capacitive body, and for each unit: providing a cathode terminal in electrical contact with the conducting layer on the capacitive body, providing an anode terminal in electrical contact with the substrate portion, characterized in that the cathode terminal is formed on a surface of the capacitive body distal to the substrate portion and the anode terminal is formed adjacent to and substantially co-planar with the cathode terminal, an electrically conductive wick providing electrical contact between the substrate portion and the anode terminal, so that the capacitors have anode and cathode terminals on a common face. By forming a capacitor with anode and cathode connections on a common face the footprint of the capacitor is minimized, whilst facilitating connection with a circuit board.
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Inventors:
Huntington, David
Application Number:
JP2001512599A
Publication Date:
February 12, 2003
Filing Date:
July 07, 2000
Export Citation:
Assignee:
ABX Limited
International Classes:
H01G9/00; H01G9/004; H01G9/012; H01G9/052; H01G9/08; (IPC1-7): H01G9/00; H01G9/004; H01G9/052; H01G9/08
Domestic Patent References:
| JPH0831696A | 1996-02-02 | |||
| JPH02301117A | 1990-12-13 | |||
| JPS5450139U | 1979-04-06 | |||
| JPH02301118A | 1990-12-13 | |||
| JPH04367212A | 1992-12-18 | |||
| JPH01169914A | 1989-07-05 |
Attorney, Agent or Firm:
Akira Asamura (3 outside)