Title:
緩衝椎間インプラント
Document Type and Number:
Japanese Patent JP2004502490
Kind Code:
A
Abstract:
The invention relates to an intervertebral implant comprising a spacer designed to be applied between two spinous processes of two vertebrae. The spacer comprises: two elements (10, 12) made of a first material, and each presenting a first end (10a, 12a) and a second end (10b, 12b), said first end (10a, 12a) being securable to a spinous process; and a connection piece (14) made of a second material of greater elastic deformability than said first material, said connection piece interconnecting said second ends (10b, 12b) of said two elements (10, 12) so that the stresses that are exerted on said two elements (10, 12) are damped, and said connection piece enabling said intervertebral implant to limit and brake the relative movements of said vertebrae.
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Inventors:
Le Quedic, Regis
Senega, Jack
Senega, Jack
Application Number:
JP2002508342A
Publication Date:
January 29, 2004
Filing Date:
July 12, 2001
Export Citation:
Assignee:
Spine Next
International Classes:
A61L27/00; A61B17/70; A61F2/44; A61B17/84; A61B17/86; A61F2/00; A61F2/30; (IPC1-7): A61F2/44; A61L27/00
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai