Title:
薄い金属層を処理する方法及び装置
Document Type and Number:
Japanese Patent JP2004511908
Kind Code:
A
Abstract:
A method and apparatus for processing a thin metal layer on a substrate to control the grain size, grain shape, and grain boundary location and orientation in the metal layer by irradiating the metal layer with a first excimer laser pulse having an intensity pattern defined by a mask to have shadow regions and beamlets. Each region of the metal layer overlapped by a beamlet is melted throughout its entire thickness, and each region of the metal layer overlapped by a shadow region remains at least partially unmelted. After completion of resolidification of the melted regions following irradiation by the first excimer laser pulse, the metal layer is irradiated by a second excimer laser pulse having a shifted intensity pattern so that the shadow regions overlap regions of the metal layer having fewer and larger grains.
Inventors:
James S
Application Number:
JP2002535162A
Publication Date:
April 15, 2004
Filing Date:
October 09, 2001
Export Citation:
Assignee:
The Trustees of Columbia University in the City of New York
International Classes:
H01L21/3205; H01L21/02; H01L21/768; (IPC1-7): H01L21/3205
Domestic Patent References:
| JPH0461338A | 1992-02-27 | |||
| JPH06232120A | 1994-08-19 | |||
| JPH04286323A | 1992-10-12 | |||
| JPH1164883A | 1999-03-05 | |||
| JPH03266436A | 1991-11-27 | |||
| JPH08203822A | 1996-08-09 |
Foreign References:
| GB2338342A | 1999-12-15 | |||
| WO1997045827A1 | 1997-12-04 |
Attorney, Agent or Firm:
Kosaku Sugimura