Title:
金属-セラミック基板、好ましくは銅-セラミック基板を製造するプロセス
Document Type and Number:
Japanese Patent JP2005520334
Kind Code:
A
Abstract:
The invention relates to a novel process for producing a metal ceramic substrate, especially a copper-ceramic substrate, in which at least one metal foil at a time is applied to the surface sides of a ceramic layer or a ceramic substrate using a high temperature bonding process and the metal foil is structured on at least one surface side for forming conductive tracks, contact surfaces, and the like.
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Inventors:
Sturs-Harder, Jachen
Application Number:
JP2003576363A
Publication Date:
July 07, 2005
Filing Date:
March 06, 2003
Export Citation:
Assignee:
Sturs-Harder, Jachen
International Classes:
H01L23/12; H05K3/00; C04B37/02; H05K3/06; H05K3/34; H05K1/02; H05K1/03; H05K3/24; H05K3/38; (IPC1-7): H05K3/00; C04B37/02; H01L23/12; H05K3/06
Domestic Patent References:
| JP2001185664A | 2001-07-06 | |||
| JPH04322491A | 1992-11-12 | |||
| JPH04343287A | 1992-11-30 | |||
| JPH05102620A | 1993-04-23 | |||
| JPH07126892A | 1995-05-16 | |||
| JPH0770767A | 1995-03-14 | |||
| JPH02238942A | 1990-09-21 | |||
| JP2001284872A | 2001-10-12 | |||
| JPH1070212A | 1998-03-10 | |||
| JPH10152384A | 1998-06-09 | |||
| JP2001127224A | 2001-05-11 | |||
| JP2001284796A | 2001-10-12 | |||
| JP2001284782A | 2001-10-12 | |||
| JPH04139788A | 1992-05-13 |
Attorney, Agent or Firm:
▲吉▼川 俊雄