Title:
銀析出のための酸性溶液、および金属表面上における銀層の析出方法
Document Type and Number:
Japanese Patent JP2005529241
Kind Code:
A
Abstract:
A processing solution and a method are used for producing solderable and bondable silver layers that properties of which are not degraded even after storing, with no anti-tarnishing compounds being utilized as contrasted with prior art solutions and methods. The acidic solution for silver deposition contains silver ions and at least one Cu(I) complexing agent, said Cu(I) complexing agent being selected from the group consisting of having the structure element (I).
Inventors:
Super link christian
Markov Hartmut
Markov Hartmut
Application Number:
JP2004511582A
Publication Date:
September 29, 2005
Filing Date:
May 27, 2003
Export Citation:
Assignee:
Atotehi Deutschland Gesellschaft Mitt Beschlenktel Haftung
International Classes:
C23C18/18; C23C18/42; C23F1/18; H05K3/24; (IPC1-7): C23C18/42; C23C18/18; C23F1/18; H05K3/24
Attorney, Agent or Firm:
Fujita Akira