Title:
リード線を支持または強化する方法と装置
Document Type and Number:
Japanese Patent JP2005538775
Kind Code:
A
Abstract:
A lead assembly and method of forming a lead assembly is provided. Devices and methods of forming the lead assembly include a support coil. The support coil provides enhanced support and protection from lead damage and failure. A lead assembly and method of forming a lead assembly is also provided including at least one electrode. Electrodes may be incorporated into the support coil design. The lead assembly and method of forming a lead assembly may be incorporated with other medical devices such as an implantable defibrillator.
Inventors:
Zarembo, Paul Yi
Ray, Gregory Earl
Brian Di, Soltis
Cox, daniel el
Bullet, bullet
Ray, Gregory Earl
Brian Di, Soltis
Cox, daniel el
Bullet, bullet
Application Number:
JP2004536231A
Publication Date:
December 22, 2005
Filing Date:
September 12, 2003
Export Citation:
Assignee:
Cardiac Pacemakers Incorporated
International Classes:
A61N1/39; A61N1/02; A61N1/05; (IPC1-7): A61N1/39; A61N1/02
Foreign References:
| US6078839A | 2000-06-20 |
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa
Shigeki Yamakawa