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Title:
埋め込み型医療デバイスの熱処理
Document Type and Number:
Japanese Patent JP2008500116
Kind Code:
A
Abstract:
A method of manufacturing an implantable medical device, such as a drug eluting stent, is disclosed. The method includes subjecting an implantable medical device that includes a polymer to a thermal condition. The thermal condition can result in reduction of the rate of release of an active agent from the device subsequent to the implantation of the device and/or improve the mechanical properties of a polymeric coating on the device.

Inventors:
Hosseini, Seed, F. A.
Tan, Ewen
Gada, mannish
Application Number:
JP2007515347A
Publication Date:
January 10, 2008
Filing Date:
May 26, 2005
Export Citation:
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Assignee:
Advanced Cardiovascular Systems, Incorporated
International Classes:
A61L31/00; A61F2/82; A61K31/337; A61K31/436; A61L27/34; A61L31/10; A61L31/16; A61P31/04; A61P35/00; A61P37/06; B05D3/00; A61F2/00
Domestic Patent References:
JP2007521069A2007-08-02
JP2003517890A2003-06-03
JP2000512323A2000-09-19
JP2003210570A2003-07-29
Foreign References:
US6712845B22004-03-30
WO2003035131A12003-05-01
WO2003022323A12003-03-20
WO2002058753A22002-08-01
WO2003082368A12003-10-09
WO2004032987A12004-04-22
WO2003097015A12003-11-27
Other References:
JPN6010069897; Circulation Vol.107,No.3, 200301, p381-383
JPN6010069893; Circulation Vol.103,No.2, 2001, p192-195
JPN6010069896; Circulation Vol.106,No.13, 2002, p1610-1613
Attorney, Agent or Firm:
Hiroshi Arafune
Yoshio Arafune