Title:
表面弾性波検知方法およびシステム
Document Type and Number:
Japanese Patent JP2008524590
Kind Code:
A
Abstract:
Sensor systems and methods are disclosed herein, including a sensor chip, upon which at least two surface acoustic wave (SAW) sensing elements are centrally located on a first side (e.g., front side) of the sensor chip. The SAW sensing elements occupy a common area on the first side of the sensor chip. An etched diaphragm is located centrally on the second side (i.e., back side) of the sensor chip opposite the first side in association with the two SAW sensing elements in order to concentrate the mechanical strain of the sensor system or sensor device in the etched diagram, thereby providing high strength, high sensitivity and ease of manufacturing thereof.
More Like This:
Inventors:
Maggie, Stephen Jay
Rio, James Zee
Cook, James Dee
Rio, James Zee
Cook, James Dee
Application Number:
JP2007546828A
Publication Date:
July 10, 2008
Filing Date:
December 12, 2005
Export Citation:
Assignee:
Honeywell International Inc.
International Classes:
G01L1/00
Attorney, Agent or Firm:
Kazuo Shamoto
Shinjiro Ono
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Fumitoshi Nishiyama
Shinjiro Ono
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Fumitoshi Nishiyama