フレキシブル膜上に導体を備える圧電ダイヤフラムアセンブリ

Japanese Patent JP2008537461

A

A laminated piezoelectric composite comprises a metallic substrate ( 20 ); a piezoelectric wafer ( 32 ) having a first surface and a second surface; a first adhesive carrier layer ( 100 ) between the first surface of the piezoelectric wafer ( 32 ) and the substrate ( 22 ); a first conductive lead ( 110 ) carried by the first adhesive carrier layer ( 100 ) and connected to a first surface of the piezoelectric wafer ( 32 ); and, a second conductive lead ( 100 ') connected to the second surface of the piezoelectric wafer ( 32 ). The first adhesive carrier layer ( 100 ) serves both to adhere the first surface of the piezoelectric wafer ( 32 ) to the substrate ( 22 ) and to carry a first conductive lead ( 110 ) for supplying an electrical signal or voltage to the first surface of the piezoelectric wafer ( 32 ). The second conductive lead ( 110 ') supplies an electrical signal or voltage to the second surface of the piezoelectric wafer ( 32 ). The first adhesive carrier layer can comprise a high dielectric soluble aromatic polyimide film. In a variant example embodiment, the laminated piezoelectric composite further comprises a second adhesive carrier layer ( 100 ') which serves to carry the second conductive lead ( 110 '). When the laminated piezoelectric composite further comprises a cover layer ( 48 ) placed on top of the piezoelectric wafer ( 32 ), the second adhesive carrier layer ( 100 ') can also serve to adhere the cover layer ( 48 ) to the second surface of the piezoelectric wafer ( 32 ).

TIETZE, BRUSE E.

JP2008506689A

September 11, 2008

April 13, 2006

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ADAPTIVENERGY LLC
TIETZE, BRUSE E.

H02N2/00

Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa

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