Title:
電解銅めっき方法
Document Type and Number:
Japanese Patent JP2009532586
Kind Code:
A
Abstract:
An electrolytic copper plating process comprising two steps is proposed. The process is particularly suited to plating in very confined spaces. The first step comprises a pre-treatment solution comprising an anti-suppressor that comprises a sulfur containing organic compound, preferably incorporating an alkane sulfonate group or groups and/or an alkane sulfonic acid. The second step comprises an electrolytic copper plating solution based on an alkane sulfonic acid.
Inventors:
James Watkowski
Maria Nicolova
Maria Nicolova
Application Number:
JP2009504184A
Publication Date:
September 10, 2009
Filing Date:
January 19, 2007
Export Citation:
Assignee:
MACDERMID,INCORPORATED
International Classes:
C25D3/38; C25D5/18; C25D5/34; C25D7/00
Domestic Patent References:
| JP2005146314A | 2005-06-09 | |||
| JP2003003291A | 2003-01-08 | |||
| JP2004342750A | 2004-12-02 | |||
| JP2003129273A | 2003-05-08 | |||
| JP2003113490A | 2003-04-18 | |||
| JP2005535787A | 2005-11-24 | |||
| JPH07157890A | 1995-06-20 |
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Nagare
Naoko Matsuda
Hiroshi Ikeda
Yoshihiro Nagare
Naoko Matsuda
Hiroshi Ikeda