Title:
キャリア溶媒組成物、塗布用組成物、及びポリマー厚膜を製造する方法
Document Type and Number:
Japanese Patent JP2012512305
Kind Code:
A
Abstract:
Compositions and methods useful for the coating of polymeric materials onto substrates, for example, electronic device substrates such as semiconductor wafers, are provided. These compositions and methods are particularly suitable manipulating thickness of a polymeric coating in a single coating event. Such methods to control photoresist thickness are used to facilitate the layering of electronic circuitry in a three-dimensional fashion. Furthermore, the compositions of the present invention may be effectively used to deposit thick films of polymeric material in a uniform manner onto inorganic substrates which provides a significant benefit over conventional systems.
Inventors:
Michael wayne kiren
Rody Palmer Holbrook, Junior
Stephanie anrone
Dale edward odale
John Cleon Moore
Rody Palmer Holbrook, Junior
Stephanie anrone
Dale edward odale
John Cleon Moore
Application Number:
JP2011542109A
Publication Date:
May 31, 2012
Filing Date:
December 03, 2009
Export Citation:
Assignee:
EASTMAN CHEMICAL COMPANY
International Classes:
C08L101/00; G03F7/004; G03F7/16; H01L21/027
Domestic Patent References:
| JPS62194249A | 1987-08-26 | |||
| JP2007241051A | 2007-09-20 | |||
| JPS59231534A | 1984-12-26 | |||
| JP2008529080A | 2008-07-31 | |||
| JP2005092003A | 2005-04-07 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Yoshihiro Kobayashi
Satoshi Deno
Atsushi Ebiya
Takashi Ishida
Tetsuji Koga
Yoshihiro Kobayashi
Satoshi Deno
Atsushi Ebiya
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