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Title:
検査ストリップを検査計から取り外すための形状記憶合金取り外し機構
Document Type and Number:
Japanese Patent JP2013519080
Kind Code:
A
Abstract:
A test strip ejection mechanism, for use with a test strip receiving port and a test strip, includes a framework, an elongated shape memory alloy (SMA) strip (e.g., a SMA wire), a slider, and a heating module. The SMA strip has first and second ends that are attached to the framework and exhibits a solid state transition temperature. The slider is configured to travel along the framework. The heating module is configured to heat the SMA strip from a temperature below the solid state transition temperature to a temperature above the solid state transition temperature. Moreover, the SMA strip and slider are configured such that the slider travels along the framework under an applied force exerted on the slider by the SMA strip as the shape memory strip is heated from a temperature below the solid state transition temperature to a temperature above the solid state temperature by the heating module. In addition, the slider has a proximal end configured to engage a test strip received within a test strip receiving port and eject the test strip from the test strip receiving port as the slider travels along the framework. A test meter for use with a test strip includes a test strip receiving port and a test strip ejection mechanism.

Inventors:
De Angeli Marco
Valsecki Luka
Application Number:
JP2012551674A
Publication Date:
May 23, 2013
Filing Date:
February 03, 2011
Export Citation:
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Assignee:
LifeScan Scotland, Ltd.
International Classes:
G01N35/02; G01N27/416
Domestic Patent References:
JP2009042227A2009-02-26
JP2011502255A2011-01-20
JPS63155752A1988-06-28
JPH04357452A1992-12-10
JPH08502590A1996-03-19
JPH08262026A1996-10-11
Foreign References:
WO2001041643A12001-06-14
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi