Title:
RELEASE FILM
Document Type and Number:
Japanese Patent JP2018062102
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a release film that has excellent transferability even when used at high temperature, and is suitable for molding a high-performance electronic component.SOLUTION: A release film has a release layer on at least one side of a polyester film, with the release layer being a metal thin film layer. Further preferably, a surface free energy on the release layer surface is 40 mJ/mor more, a surface roughness (Sa) of the release layer surface is 50 nm or less, and a thermal shrinkage of the release film after heat treatment at 160°C for 30 minutes is 1.0% or less.SELECTED DRAWING: None
Inventors:
NAKATANI MITSUHARU
NUMATA YUKIHIRO
TATAMI O
KASHIWA MITSUHIRO
ITO KATSUYA
NUMATA YUKIHIRO
TATAMI O
KASHIWA MITSUHIRO
ITO KATSUYA
Application Number:
JP2016200956A
Publication Date:
April 19, 2018
Filing Date:
October 12, 2016
Export Citation:
Assignee:
TOYO BOSEKI
International Classes:
B32B27/36; B32B27/00
Domestic Patent References:
| JP2014205247A | 2014-10-30 | |||
| JP2005125756A | 2005-05-19 | |||
| JP2004090488A | 2004-03-25 | |||
| JP2010053310A | 2010-03-11 |