Title:
MODULE SUBSTRATE
Document Type and Number:
Japanese Patent JP2018157260
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a module substrate capable of radiating a signal in 100 GHz band or higher into a space or collecting power in the space with high efficiency and low loss.SOLUTION: The present invention relates to a module substrate in which a rectangular waveguide structure including a waveguide opening is connected onto a top layer. The module substrate comprises: multiple metal wiring layers each including a first metal wiring layer which is laminated via a dielectric layer and includes a transmission line and a coupling element that is formed in a part of the transmission line, and a second metal wiring layer which is laminated at a position away from the rectangular waveguide structure rather than the first metal wiring layer; and multiple vias which connect adjacent metal wiring layers. In the top layer, a first opening which faces the waveguide opening and surrounds the coupling element in a plan view from the top layer is provided. Within a range in which the first opening is projected, between the first metal wiring layer and the second metal wiring layer, a region of the dielectric layer that is surrounded by partial vias among the multiple vias is formed. A size of the region in a plan view is smaller than that of the waveguide opening.SELECTED DRAWING: Figure 4
More Like This:
Inventors:
MIZUNO KOICHI
Application Number:
JP2017050108A
Publication Date:
October 04, 2018
Filing Date:
March 15, 2017
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
H01P5/107; H05K1/02; H05K3/46
Attorney, Agent or Firm:
Koichi Washida