Title:
PRESSURE SENSOR CHIP, PRESSURE TRANSMITTER, AND METHOD FOR MANUFACTURING PRESSURE SENSOR CHIP
Document Type and Number:
Japanese Patent JP2018159594
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a pressure sensor chip having a new chip structure with which it is possible to realize multiple measurement ranges.SOLUTION: A pressure sensor chip 1 according to the present invention comprises a first layer 11 having a pressure introduction path 111 opened in a first principal plane and a second principal plane, a diaphragm 124 covering one end of the pressure introduction path, a first strain gauge 126, and a second strain gauge 125, and includes a second layer 12 arranged on the second principal plane of the first layer, a third principal plane, and a recess 131 formed on the third principal plane, the third principal plane having a third layer 13 arranged on the second layer, the recess being formed facing the pressure introduction path via the diaphragm, the recess being formed inside the pressure introduction path as seen from a direction perpendicular to the first principal plane, the first strain gauge being formed in an area on the outside of the recess as seen from a direction perpendicular to the first principal plane, the second strain gauge being formed in a more inner area than the first strain gauge as seen from a direction perpendicular to the first principal plane.SELECTED DRAWING: Figure 1B
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Inventors:
TOKUDA TOMOHISA
Application Number:
JP2017056192A
Publication Date:
October 11, 2018
Filing Date:
March 22, 2017
Export Citation:
Assignee:
AZBIL CORP
International Classes:
G01L9/00; G01L19/06; H01L29/84
Domestic Patent References:
| JP2002208708A | 2002-07-26 | |||
| JP2005069736A | 2005-03-17 | |||
| JPH1073503A | 1998-03-17 |
Foreign References:
| US20150114129A1 | 2015-04-30 |
Attorney, Agent or Firm:
Shigeki Yamakawa
Masaki Yamakawa
Masaki Yamakawa