Title:
METHOD AND DEVICE FOR MANUFACTURING DEVICE CHIP
Document Type and Number:
Japanese Patent JP2019067819
Kind Code:
A
Abstract:
To prevent an ashing failure to increase the productivity.SOLUTION: A method for manufacturing a device chip comprises: a mask formation step of forming a mask 30 for covering the device region 27 on a first face of a substrate 2 having the first face with a plurality of device regions 27 defined by dividing areas, and a second face on a side opposite to the first face, with the dividing area 28 exposed on the first face; a dividing step of exposing the first face to plasma to etch the dividing area 28 until the second face is reached, with the second face held by a holding member 22, thereby dicing the substrate 2 into a plurality of device chips 24; and a mask-removing step of pressing a porous body 19 against the device chips 24 and in this state, relatively sliding the porous body thereon, thereby removing at least a part of the mask 30 remaining on the surface.SELECTED DRAWING: Figure 2
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Inventors:
ITO AKIHIRO
HARIGAI ATSUSHI
MATSUBARA ISAYUKI
OKITA SHOGO
HARIGAI ATSUSHI
MATSUBARA ISAYUKI
OKITA SHOGO
Application Number:
JP2017188784A
Publication Date:
April 25, 2019
Filing Date:
September 28, 2017
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H01L21/301; H01L21/304; H01L21/3065
Domestic Patent References:
| JP2012248741A | 2012-12-13 | |||
| JP2001237236A | 2001-08-31 | |||
| JP2015532008A | 2015-11-05 | |||
| JP2009043811A | 2009-02-26 |
Attorney, Agent or Firm:
Mitsuo Tanaka
Samejima Mutsumi
Yoshiyuki Maebori
Samejima Mutsumi
Yoshiyuki Maebori