Title:
HIGH FREQUENCY TRANSMISSION LINE
Document Type and Number:
Japanese Patent JP2019080193
Kind Code:
A
Abstract:
To provide a high frequency transmission line that can be mass produced, and can restrain loss.SOLUTION: A high frequency transmission line includes a multilayer board, a signal line, a signal via, at least one ground plane, and multiple ground vias. Between the signal via and the multiple ground vias, an interlayer transmission line for transmitting high frequency signals in the lamination direction is formed. a via diameter of the signal via is formed with such dimension that a high frequency signal is transmitted in multi-mode interference transmission forming a strong area where the electric field strength is strong in the transmission direction and a weak area where the electric field strength is weaker than the strong area, in the interlayer transmission line. Furthermore, at least one of the inter-via distance between the signal via and the ground via, the via diameter, and the thickness of the multilayer board is formed so that the high frequency signal is introduced from the interlayer transmission line to the signal line in the strong area of multi-mode interference transmission.SELECTED DRAWING: Figure 5
Inventors:
SAKURAI KAZUMASA
WAKITA KAZUYA
SUMIYA YUJI
WAKITA KAZUYA
SUMIYA YUJI
Application Number:
JP2017206232A
Publication Date:
May 23, 2019
Filing Date:
October 25, 2017
Export Citation:
Assignee:
SOKEN INC
DENSO CORP
DENSO CORP
International Classes:
H01P5/08; H05K3/46
Domestic Patent References:
| JP2003204209A | 2003-07-18 |
Foreign References:
| US20080003872A1 | 2008-01-03 |
Other References:
小西良弘著, マイクロ波回路の基礎とその応用 −基礎知識から新しい応用まで−, JPN6018050952, 1990, pages 45 - 47, ISSN: 0004437992
Attorney, Agent or Firm:
Nagoya International Patent Service Corporation