Title:
SPUTTERING APPARATUS AND MANUFACTURING METHOD OF ORGANIC EL PANEL
Document Type and Number:
Japanese Patent JP2019090083
Kind Code:
A
Abstract:
To provide a sputtering apparatus capable of reducing a damage of a substrate to be treated caused by an ultraviolet light and a charged particle attributed to a plasma.SOLUTION: A shield member is arranged between a target and a substrate to be treated for shielding the substrate to be treated from a sputtering particle scattering from the target in an upstream side of a transportation direction of the substrate to be treated. When a center reference line is defined as a line running on a center of the transportation direction on a magnetic polar of a center magnet and extending in a normal direction to a target surface, a first boundary line is defined as a line running on an upstream edge of the transportation direction of a peripheral magnet and being parallel to the center reference line, and a second boundary line is defined as a line running on a downstream edge of the transportation direction of the peripheral magnet and being parallel to the center reference line, an edge of the shield member in a scattering region is located in a region sandwiched between the first boundary line and the second boundary line.SELECTED DRAWING: Figure 4
Inventors:
UCHIDA TOSHIHARU
SUGAWARA HIROKI
SUGAWARA HIROKI
Application Number:
JP2017219840A
Publication Date:
June 13, 2019
Filing Date:
November 15, 2017
Export Citation:
Assignee:
CANON TOKKI CORP
International Classes:
C23C14/34; C23C14/00; C23C14/35; H01L21/285; H01L51/50; H05B33/10
Domestic Patent References:
| JP2005213587A | 2005-08-11 | |||
| JP2015067856A | 2015-04-13 | |||
| JP2010174331A | 2010-08-12 | |||
| JP2015193863A | 2015-11-05 | |||
| JP2000096226A | 2000-04-04 | |||
| JP2001081553A | 2001-03-27 |
Attorney, Agent or Firm:
Takeshi Niwa
Takeshi Nakamura
Koichiro Sakai
Ryota Morihiro
Yoshiyuki Kawaguchi
Takeshi Nakamura
Koichiro Sakai
Ryota Morihiro
Yoshiyuki Kawaguchi