Title:
SPUTTERING DEVICE
Document Type and Number:
Japanese Patent JP2019094533
Kind Code:
A
Abstract:
To provide a technique capable of improving film deposition precision and a technique capable of reducing wasting of a target material while improving the film deposition precision.SOLUTION: Among virtual straight lines which extend from a center point of a cylindrical target 40A in a radial direction of the target 40A to pass between a first magnet 401A and a second magnet 402A in a cross section orthogonal to a center axis of the target 40A, a first virtual straight line L1 passing a first point Z1 at which a magnetic flux density component in a normal direction of a surface of the target 40A is 0 on the surface crosses a processed surface 11a of a substrate 10 at right angles, and a second virtual straight line L2 passing a second point Z2 which is different from the first point Z1 and at which the magnetic flux density component is 0 on the surface of the target 40A of the virtual straight lines does not cross the substrate 10.SELECTED DRAWING: Figure 1
Inventors:
AONUMA DAISUKE
WATABE ARATA
WATABE ARATA
Application Number:
JP2017223803A
Publication Date:
June 20, 2019
Filing Date:
November 21, 2017
Export Citation:
Assignee:
CANON TOKKI CORP
International Classes:
C23C14/35; C23C14/34; H01L21/285
Domestic Patent References:
| JP2014500398A | 2014-01-09 |
Attorney, Agent or Firm:
Takeshi Niwa
Takeshi Nakamura
Koichiro Sakai
Ryota Morihiro
Yoshiyuki Kawaguchi
Takeshi Nakamura
Koichiro Sakai
Ryota Morihiro
Yoshiyuki Kawaguchi