Title:
PAD INSERTION DEVICE, BINDING SYSTEM, AND BINDING BAND BINDING METHOD
Document Type and Number:
Japanese Patent JP2019104526
Kind Code:
A
Abstract:
To provide a pad insertion device, a binding system and a binding band binding method that can insert a pad even in a non-horizontal state, and have a long life and significantly reduce damage to a surface of a bound object.SOLUTION: A pad insertion device 100 for inserting a pad to be interposed between a binding joint part and an object 1 to be bound, comprises: an accommodation mechanism part 10 for loading and accommodating a plurality of pads and delivering one of the stacked pads to a first delivery position; an insertion mechanism part 20 having a first suction holding part for suctioning the pad positioned at the first delivery position and movable from the first delivery position to a second delivery position for mounting a pad on the object to be bound; and a holding mechanism part 30 for holding the pad moved to the second delivery position by the insertion mechanism part until the binding joint part is formed by the binding band constraining the object to be bound.SELECTED DRAWING: Figure 1
Inventors:
MUNECHIKA SHINYA
UCHIYAMA SATOSHI
UCHIYAMA SATOSHI
Application Number:
JP2017238325A
Publication Date:
June 27, 2019
Filing Date:
December 13, 2017
Export Citation:
Assignee:
KOHAN KOGYO
International Classes:
B65B27/06; B65D71/04
Attorney, Agent or Firm:
Patent business corporation Ota patent office