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Title:
REPEAT BENDING DEVICE, MANUFACTURING METHOD THEREFOR AND SUPPRESSION METHOD OF BENT TRACE
Document Type and Number:
Japanese Patent JP2019172932
Kind Code:
A
Abstract:
To provide a repeat bending device hardly generating bent trace after releasing the same from a bent state, when repeatedly bent, or stood at a bending state for long time.SOLUTION: There is provided a repeat bending device 10A having one or a plurality of adhesive layers 111, 112 and 113, at least one layer of the adhesive layers is constituted by an adhesive having relaxation modulus variation ΔlogG(t) calculated from the following formula (I), wherein a maximum relaxation modulus value measured when the adhesive is strained at 10% is G(t)(MPa), a minimum relaxation modulus value measured during keeping straining the adhesive at 10% from when the maximum relaxation modulus G(t)is measured to 3757 sec. later is minimum relaxation modulus G(t)(MPa), of 1.20 or less. ΔlogG(t)=logG(t)-logG(t)(I).SELECTED DRAWING: Figure 2

Inventors:
NANASHIMA YUTAKA
Application Number:
JP2018066052A
Publication Date:
October 10, 2019
Filing Date:
March 29, 2018
Export Citation:
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Assignee:
LINTEC CORP
International Classes:
C09J7/38; C09J7/10; C09J11/06; C09J133/04; C09J201/00
Domestic Patent References:
JP2017155205A2017-09-07
JP2013177568A2013-09-09
JP2018027996A2018-02-22
JP2017095653A2017-06-01
JP2010192636A2010-09-02
JP2016501518A2016-01-21
Foreign References:
WO2018174012A12018-09-27
WO2013018602A12013-02-07
KR20160070940A2016-06-21
Attorney, Agent or Firm:
Yuji Hayakawa
Keisuke Murasame