Title:
ELECTRONIC COMPONENT MOUNTING APPARATUS
Document Type and Number:
Japanese Patent JP2019174551
Kind Code:
A
Abstract:
To provide an electronic component mounting apparatus which can be configured inexpensively.SOLUTION: The electronic component mounting apparatus comprises: a power source substrate 90 having a substrate face 90a on which electronic components 95 are mounted; a left frame 12 constituted of a non-flame-retardant resin member, extending in a direction vertical to the substrate face 90a and supporting the power source substrate 90 on the side of a left side 902; and a cover 91 constituted of a metal member, provided along a rear side 903 and a front side 904 in parallel therewith crossing the left side 902 of the power source substrate 90 and covering the electronic components 95 and the substrate face 90a. The power source substrate 90 includes: a heat sink 97 provided in the power source substrate 90 on the side of the left side 902 in an upright manner on the substrate face 90a; and a rectifier diode 951, which is one of the electronic components 95, mounted on an upright face 971 of the heat sink 97. The heat sink 97 includes a shielding portion 972 extending from the upright face 971 so as to shield a gap between the cover 91 and the rectifier diode 951 in a direction vertical to the substrate face 90a.SELECTED DRAWING: Figure 3
Inventors:
HASHIZUME DAIKI
MUNEDA MAKOTO
MUNEDA MAKOTO
Application Number:
JP2018060645A
Publication Date:
October 10, 2019
Filing Date:
March 27, 2018
Export Citation:
Assignee:
BROTHER IND LTD
International Classes:
G03G15/00; B41J29/00; B41J29/02; G03G21/00; G03G21/16; H02M3/00
Domestic Patent References:
| JP2017156636A | 2017-09-07 | |||
| JP2010032010A | 2010-02-12 | |||
| JP2005111713A | 2005-04-28 | |||
| JPH11233978A | 1999-08-27 |
Foreign References:
| US20100271785A1 | 2010-10-28 |
Attorney, Agent or Firm:
Yanouchi Foreign Patent Office