Title:
ELECTROMAGNETIC WAVE ABSORBING ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP2020013848
Kind Code:
A
Abstract:
To provide an electromagnetic wave absorbing adhesive sheet which is thin and has excellent electromagnetic wave absorbing properties.SOLUTION: An electromagnetic wave absorbing adhesive sheet according to one embodiment of the present invention includes an electromagnetic wave absorbing base material that includes a fiber layer and a first resin layer provided on a surface of the fiber layer, and in which a surface resistivity of the fiber layer is 1×108 Ω/sq. or less, and an adhesive layer provided on the surface of the substrate opposite to the first resin layer. Such the electromagnetic wave absorbing adhesive sheet is thin and has excellent electromagnetic wave absorbing properties, such that electromagnetic waves do not reflect off the electromagnetic wave absorbing adhesive sheet but are reliably absorbed by the electromagnetic wave absorbing adhesive sheet. This makes it difficult for electromagnetic waves to leak not only above an electronic component to which the electromagnetic wave absorbing adhesive sheet is attached, but also beside the electronic component.SELECTED DRAWING: Figure 1
Inventors:
MATSUSHITA TAIGA
INAO YOICHI
INAO YOICHI
Application Number:
JP2018134037A
Publication Date:
January 23, 2020
Filing Date:
July 17, 2018
Export Citation:
Assignee:
LINTEC CORP
International Classes:
H05K9/00; B32B27/00; B32B27/18
Domestic Patent References:
| JP2011146696A | 2011-07-28 | |||
| JP2015082554A | 2015-04-27 | |||
| JP2010080911A | 2010-04-08 |
Foreign References:
| WO2015076387A1 | 2015-05-28 |
Attorney, Agent or Firm:
Junichi Omori
Mitsuru Takahashi
Yukinobu Hibino
Mitsuru Takahashi
Yukinobu Hibino