Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2020047731
Kind Code:
A
Abstract:
To provide a curable resin composition for forming, by a roll coating method, a high-quality solder resist coating film having a good surface condition and superior insulation reliability with no tack mark on a dried coating film surface while avoiding the crawling or nonuniformity of a coating film and air bubble immixture into the coating film surface, a cured product thereof, and a printed wiring board.SOLUTION: A curable resin composition for roll coating comprises: a carboxyl group-containing resin; a photopolymerization initiator; an organic solvent; and a surface conditioner. The surface conditioner contains: a modified polydimethylsiloxane resulting from the organic modification of polydimethylsiloxane, in which "n" in the general formula (1) below is in a range of 2-27; and a modified polydimethylsiloxane resulting from the organic modification of polydimethylsiloxane, in which "n" in the general formula (1) falls in a range of 45-230.SELECTED DRAWING: None
Inventors:
YODA KENJI
OKAYASU KATSUKI
TAKII YOJI
KITAMURA TARO
ITO NOBUHITO
OKAYASU KATSUKI
TAKII YOJI
KITAMURA TARO
ITO NOBUHITO
Application Number:
JP2018174176A
Publication Date:
March 26, 2020
Filing Date:
September 18, 2018
Export Citation:
Assignee:
TAIYO INK MFG CO LTD
International Classes:
H05K3/28; G03F7/004; G03F7/027; G03F7/075
Foreign References:
| WO2014010345A1 | 2014-01-16 |
Attorney, Agent or Firm:
Ichiro Honda
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro