Title:
CONNECTION STRUCTURE, MANUFACTURING METHOD THEREOF, AND INVERTER DEVICE
Document Type and Number:
Japanese Patent JP2020077520
Kind Code:
A
Abstract:
To provide a connection structure capable of performing processing at lower cost by eliminating the need of a process for providing a groove at a bus bar side and inserting a contact band, a manufacturing method thereof and an inverter device.SOLUTION: A connection structure comprises substrates 10A and 10B, a conductive elastic member 12 and a bus bar 14 including a pair of connection parts 14A1 and 14A2. The conductive elastic member 12 is connected to the substrates 10A and 10B. The bus bar 14 including the pair of connection parts 14A1 and 14A2 is disposed so as to hold the substrates 10A and 10B and the elastic member 12. The elastic member 12 is elastically deformable with respect to a first direction which is a thickness direction of the substrates 10A and 10B. The elastic member 12 is brought into contact with at least any one of the pair of connection parts 14A1 and 14A2 which face each other with respect to the first direction.SELECTED DRAWING: Figure 3
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Inventors:
MIBU KAZUYUKI
Application Number:
JP2018209865A
Publication Date:
May 21, 2020
Filing Date:
November 07, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01R13/24; H01L23/12; H01L25/07; H01L25/18; H01R4/58; H05K1/14; H05K3/36
Attorney, Agent or Firm:
Fukami patent office