Title:
WAFER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2020136405
Kind Code:
A
Abstract:
To form a device chip without deteriorating quality.SOLUTION: A wafer processing method for dividing a wafer in which a plurality of devices are formed in each region on a surface partitioned by division schedule lines into individual device chips comprises a polyester-based sheet arranging step, an integrating step, a dividing step, and a picking-up step. The polyester-based sheet arranging step positions the wafer in an opening of a frame and arranges a polyester-based sheet in a rear surface of the wafer and an outer periphery of the frame, the opening housing the wafer. The integrating step heats and presses the polyester-based sheet, and integrates the wafer and the frame via the polyester-based sheet. The dividing step forms a division groove by irradiating the wafer with a laser beam of a wavelength having absorbability to the wafer along the division schedule lines and divides the wafer into individual device chips. The picking-up step applies ultrasonic waves to the polyester-based sheet, pushes up the device chip, and picks up the device chip from the polyester-based sheet.SELECTED DRAWING: Figure 4
Inventors:
HARADA SHIGENORI
MATSUZAWA MINORU
KIUCHI ITSUTO
YODO YOSHIAKI
ARAKAWA TARO
UENO MASAMITSU
KAWAMURA SUMIKO
FUJII YUSUKE
MIYAI TOSHITERU
OMAE MAKIKO
MATSUZAWA MINORU
KIUCHI ITSUTO
YODO YOSHIAKI
ARAKAWA TARO
UENO MASAMITSU
KAWAMURA SUMIKO
FUJII YUSUKE
MIYAI TOSHITERU
OMAE MAKIKO
Application Number:
JP2019025971A
Publication Date:
August 31, 2020
Filing Date:
February 15, 2019
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B23K26/364; H01L21/683
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro
Ei Okamoto
Takayuki Okano
Tomohiro Okamoto
Kasahara Takahiro
Ei Okamoto
Takayuki Okano