WAFER PROCESSING METHOD

Japanese Patent JP2020136409

A

To form a device chip without deteriorating quality.SOLUTION: A wafer processing method for dividing a wafer in which a plurality of devices are formed on a surface into individual device chips comprises a polyester-based sheet arranging step, an integrating step, a frame supporting step, a dividing step, and a picking-up step. The polyester-based sheet arranging step arranges a polyester-based sheet on a rear surface of the wafer. The integrating step heats the polyester-based sheet and integrates the wafer and the polyester-based sheet by thermal compression bond. The frame supporting step supports the polyester-based sheet by a frame composed of a first frame including an opening and a plurality of magnets and a second frame including an opening by holding an outer periphery of the polyester-based sheet between the first frame and the second frame by a magnetic force using the frame. The dividing step divides the wafer into individual device chips. The picking-up step applies ultrasonic waves to the polyester-based sheet, and pushes up the device chip.SELECTED DRAWING: Figure 4

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HARADA SHIGENORI
MATSUZAWA MINORU
KIUCHI ITSUTO
YODO YOSHIAKI
ARAKAWA TARO
UENO MASAMITSU
KAWAMURA SUMIKO
FUJII YUSUKE
MIYAI TOSHITERU
OMAE MAKIKO

JP2019025975A

August 31, 2020

February 15, 2019

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DISCO ABRASIVE SYSTEMS LTD

H01L21/301; B23K26/364; H01L21/683

Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro
Ei Okamoto
Takayuki Okano

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