Title:
SEALING COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2020139042
Kind Code:
A
Abstract:
To provide a sealing composition wherein, when it is cured, the cured product has improved thermal conductivity, while an elastic modulus of the cured product at high temperature is kept low.SOLUTION: A sealing composition has: a first epoxy resin that has, in its molecule, at least two aromatic hydrocarbon rings, and an ether link that connects the two aromatic hydrocarbon rings directly or through a linking group; a curing agent; and an inorganic filler.SELECTED DRAWING: None
Inventors:
TANAKA MIKA
ISHIBASHI KENTA
KODAMA TAKUYA
HORI KEICHI
ISHIBASHI KENTA
KODAMA TAKUYA
HORI KEICHI
Application Number:
JP2019035276A
Publication Date:
September 03, 2020
Filing Date:
February 28, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08G59/20; C08K3/00; C08K5/13; C08K5/17; C08L63/00
Domestic Patent References:
| JP2009173728A | 2009-08-06 | |||
| JP2012197366A | 2012-10-18 | |||
| JP2009242572A | 2009-10-22 | |||
| JP2009073862A | 2009-04-09 | |||
| JP2012017405A | 2012-01-26 |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office