Title:
MANUFACTURING METHOD OF SEMICONDUCTOR CHIP INTEGRATED DEVICE, SEMICONDUCTOR CHIP INTEGRATED DEVICE, SEMICONDUCTOR CHIP INK AND SEMICONDUCTOR CHIP INK DISCHARGE DEVICE
Document Type and Number:
Japanese Patent JP2020155428
Kind Code:
A
Abstract:
To provide a manufacturing method of a semiconductor chip integrated device capable of manufacturing, at low cost, various semiconductor chip integrated devices including micro LED displays.SOLUTION: A semiconductor chip integrated device is manufactured in such a manner that a droplet-like semiconductor chip ink 103 containing a semiconductor chip which comprises a first electrode and a second electrode on a top face and a bottom face and is configured to attract one of first electrode side and second electrode side to a magnetic field more stronger than the other electrode side, and a liquid is supplied to a chip coupling part of a mount substrate including multiple chip coupling parts 45 on one principal surface. One of the first electrode side and the second electrode side of the semiconductor chip in the semiconductor chip ink is attracted by a magnetic field generated by a ferromagnetic substance contained in the chip coupling part or by an external magnetic field, brought into contact with the chip coupling part, and electrically and mechanically coupled to the chip coupling part by plating, etc., thereafter.SELECTED DRAWING: Figure 7
Inventors:
TAKEYA MOTONOBU
Application Number:
JP2019049276A
Publication Date:
September 24, 2020
Filing Date:
March 18, 2019
Export Citation:
Assignee:
RD TECH CO LTD
International Classes:
H01L33/48; H01L31/02; H01L31/10; H01S5/022
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Attorney, Agent or Firm:
Koichi Mori