Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2020160146
Kind Code:
A
Abstract:
To provide a photosensitive resin composition that gives a cured product having excellent flexibility (plasticity) and matte effect while having excellent insulation reliability, and has excellent coatability.SOLUTION: A photosensitive resin composition contains (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) an epoxy compound, (D) a carboxyl group-modified silicone oil, (E) a reactive diluent.SELECTED DRAWING: None
Inventors:
UESUGI NAOYUKI
OKADA MARI
OKADA MARI
Application Number:
JP2019056911A
Publication Date:
October 01, 2020
Filing Date:
March 25, 2019
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK
International Classes:
G03F7/004; G03F7/027; H05K3/28
Domestic Patent References:
| JP2014222367A | 2014-11-27 | |||
| JP2014066809A | 2014-04-17 |
Foreign References:
| WO2017159190A1 | 2017-09-21 | |||
| WO2016157587A1 | 2016-10-06 |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Shuichi Sumiyoshi
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Shuichi Sumiyoshi