Title:
LEAD-FREE SOLDER ALLOY, SOLDER PASTE, ELECTRONIC CIRCUIT MOUNTING SUBSTRATE AND ELECTRONIC CONTROLLER
Document Type and Number:
Japanese Patent JP2021037545
Kind Code:
A
Abstract:
To provide a lead-free solder alloy, a solder paste, an electronic circuit mounting substrate and an electronic controller where both of the crack propagation inhibiting effect of a solder joint under the circumstances of large temperature difference and resistance to shock accompanying high speed deformation can be achieved and which are suitably used for, especially, an on-vehicle electronic mounting substrate and an on-vehicle electronic controller.SOLUTION: A lead-free solder alloy contains 2 mass% or more and 4 mass% or less of Ag, 0.3 mass% or more and 1 mass% or less of Cu, 1 mass% or more and less than 3 mass% of Bi, 1 mass% or more and less than 3 mass% of In and the balance Sn (where, Sn-3-3.5, Ag-2.5, Bi-2.5, In-0.5 Cu, Sn-2-3, Ag-2, Bi-1 and In-0.5Cu are excluded).SELECTED DRAWING: Figure 1
Inventors:
ARAI MASAYA
NAKANO KEN
KATSUYAMA TSUKASA
MUNEKAWA YURIKA
MARUYAMA DAISUKE
SHIMAZAKI TAKANORI
NAKANO KEN
KATSUYAMA TSUKASA
MUNEKAWA YURIKA
MARUYAMA DAISUKE
SHIMAZAKI TAKANORI
Application Number:
JP2020189232A
Publication Date:
March 11, 2021
Filing Date:
November 13, 2020
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK
International Classes:
B23K35/26; B23K35/22; C22C13/00; C22C13/02; H05K3/34
Domestic Patent References:
| JP2014037005A | 2014-02-27 | |||
| JP2016010818A | 2016-01-21 | |||
| JP2001168519A | 2001-06-22 | |||
| JP2015205345A | 2015-11-19 |
Foreign References:
| WO2000018536A1 | 2000-04-06 |
Attorney, Agent or Firm:
Yoko Ota