Title:
SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM AND SOLDER JOINT
Document Type and Number:
Japanese Patent JP2021037548
Kind Code:
A
Abstract:
To provide a solder alloy which exhibits excellent temperature cycle characteristics and drop impact resistance, suppresses yellowing, maintains excellent wettability and can suppress an increase over time in the viscosity of a solder paste; and a solder paste, a solder ball, a solder preform and a solder joint that are obtained using this solder alloy.SOLUTION: This solder alloy contains, in terms of mass%, 0.2-1.2% of Ag, 0.6-0.9% of Cu, 1.2-3.0% of Bi, 0.01-2.0% of In, 0.02-1.0% of Sb and 0.0040-0.025% of As, with the remainder consisting of Sn.SELECTED DRAWING: Figure 1
Inventors:
KAWASAKI HIROYOSHI
SHIRATORI MASATO
KAWAMATA YUJI
SHIRATORI MASATO
KAWAMATA YUJI
Application Number:
JP2020193914A
Publication Date:
March 11, 2021
Filing Date:
November 20, 2020
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO
International Classes:
B23K35/26; C22C13/00; C22C13/02
Attorney, Agent or Firm:
Hideki