CONDUCTIVE COMPOUND AND CONDUCTIVE COMPOSITION

Title:

CONDUCTIVE COMPOUND AND CONDUCTIVE COMPOSITION

Document Type and Number:

Japanese Patent JP2021077479

Kind Code:

A

Abstract:

To provide a conductive compound and a conductive composition having excellent applicability.SOLUTION: A conductive compound in the present invention has a conductive polymer having an acidic group, and a basic compound. A 1 mass% aqueous solution of the conductive compound has a surface tension at 25°C of 62 mN/m or less. A conductive composition in the present invention has the conductive compound and a solvent, the solvent has water, and the water content is 80 mass% or more relative to the total mass of the solvent.SELECTED DRAWING: None

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Inventors:

UZAWA MASASHI
NAKANO SAKI

Application Number:

JP2019201438A

Publication Date:

May 20, 2021

Filing Date:

November 06, 2019

Export Citation:

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Assignee:

MITSUBISHI CHEM CORP

International Classes:

H01B1/12; C08K5/3435; C08L101/12; H01B1/20

Domestic Patent References:

JP2015086247A	2015-05-07
JP2011187935A	2011-09-22
JP2011192983A	2011-09-29

Attorney, Agent or Firm:

Field Saki Satoshi
Shunsuke Fushimi
Kazunori Onami

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