Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
Japanese Patent JP2021100213
Kind Code:
A
Abstract:
To improve a noise figure (NF).SOLUTION: In a high frequency module 1, a first inductor 45A is arranged on a first principal surface 51 of a mounting board 5 and provided on an input side of a first low noise amplifier 2A on a first reception path through which a first reception signal of a first frequency passes. A second inductor 45B is arranged on the first principal surface 51 of the mounting board 5 and provided on an input side of a second low noise amplifier 2B on a second reception path through which a second reception signal of a second frequency lower than the first frequency passes. A high frequency component is arranged between the first inductor 45A and the second inductor 45B. A distance L1 between the first inductor 45A and a shield layer 83 is longer than a distance L2 between the second inductor 45B and the shield layer 83. The first inductor 45A overlaps with the first low noise amplifier 2A in a thickness direction of the mounting board 5.SELECTED DRAWING: Figure 2
Inventors:
ITO TAKANORI
TAKEUCHI TAKEHISA
YAMAGUCHI YUKIYA
TAKEUCHI TAKEHISA
YAMAGUCHI YUKIYA
Application Number:
JP2019231766A
Publication Date:
July 01, 2021
Filing Date:
December 23, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H04B1/38; H01L21/822; H01L23/00; H01L23/28; H01L25/04; H01L25/18; H01L27/04; H04B1/00
Attorney, Agent or Firm:
Patent business corporation Hokuto patent office
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