Title:
HINGED LAMINATE, HINGED LAMINATE ARRAY SHEET, AND MANUFACTURING METHOD FOR HINGED LAMINATE
Document Type and Number:
Japanese Patent JP2021140804
Kind Code:
A
Abstract:
To provide a hinged laminate having thin thickness, and a hinged laminate array sheet.SOLUTION: A hinged laminated body 20 includes: an IC module 30 having an IC chip 32 capable of performing contactless communication; a hinge layer 41 having a hinge section 41a which can be bound into a booklet; and a non-hinge layer 42 which is laminated onto the hinge layer 41 and does not have a hinge part, where the hinge layer 41 is disposed over the entire surface of the laminated body 20, the hinge layer 41 and the non-hinge layer 42 have a housing hole 47 penetrating across the two layers, and the IC module 30 is housed and held inside the housing hole 47.SELECTED DRAWING: Figure 1B
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Inventors:
MOTOI TAKUMI
NISHIOKA TORU
NISHIOKA TORU
Application Number:
JP2021076575A
Publication Date:
September 16, 2021
Filing Date:
April 28, 2021
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
G06K19/077; B42D25/24; B42D25/305; B42D25/40; G06K19/02
Domestic Patent References:
| JP2012166458A | 2012-09-06 | |||
| JP2012137807A | 2012-07-19 | |||
| JP2012038324A | 2012-02-23 | |||
| JP2012187847A | 2012-10-04 | |||
| JP2011134048A | 2011-07-07 |
Foreign References:
| US20140326789A1 | 2014-11-06 | |||
| US20150227829A1 | 2015-08-13 |
Attorney, Agent or Firm:
Masayuki Masabayashi
Tetsuo Shiba
Hayashi Ichiyoshi
Tetsuo Shiba
Hayashi Ichiyoshi