Title:
SUBSTRATE BONDING DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP2022188313
Kind Code:
A
Abstract:
To detect the state of progress of bonding substrates.SOLUTION: A substrate bonding device includes a pair of electrodes 351a arranged to sandwich at least one of substrates 211 and 213, and a detection unit 353a that detects electrostatic properties between two electrodes included in the pair of electrodes. A contact region is formed by bringing parts of the respective substrates into contact with each other, and when the contact region is expanded in the plane direction, the detection unit detects the electrostatic characteristics between the two electrodes included in the pair of electrodes 351a arranged to sandwich at least one of the substrates 211 and 213 to detect the state of the contact area, that is, the bonding process of the substrates.SELECTED DRAWING: Figure 4A
Inventors:
USHIJIMA MIKIO
OMORI KAORU
MITSUISHI SO
SHIOMI TAKASHI
TSUNODA MASAO
OMORI KAORU
MITSUISHI SO
SHIOMI TAKASHI
TSUNODA MASAO
Application Number:
JP2019214158A
Publication Date:
December 21, 2022
Filing Date:
November 27, 2019
Export Citation:
Assignee:
NIKON CORP
International Classes:
H01L21/02; H01L21/68; H01L21/683
Attorney, Agent or Firm:
Patent Attorney Corporation RYUKA International Patent Office