Title:
半導体パッケージのリード曲げ用治工具およびこれを用いたリード曲げ装置
Document Type and Number:
Japanese Patent JP2549769
Kind Code:
Y2
More Like This:
Inventors:
Takuya Gendoshi
Katsuyuki Ishioka
Katsuyuki Ishioka
Application Number:
JP1767391U
Publication Date:
September 30, 1997
Filing Date:
February 28, 1991
Export Citation:
Assignee:
京セラ株式会社
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JPH0279455A | ||||
| JPS6044271A | ||||
| JP63150714B | ||||
| JPS6044270A |