Title:
【考案の名称】半導体パッケージ
Document Type and Number:
Japanese Patent JP2569932
Kind Code:
Y2
Inventors:
Yamamoto Tadahisa
Koji Soga
Arayama Motohide
Koji Soga
Arayama Motohide
Application Number:
JP4064091U
Publication Date:
April 28, 1998
Filing Date:
May 31, 1991
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/04; H01L23/00; H01L23/02; (IPC1-7): H01L23/04; H01L23/00
Domestic Patent References:
| JP51126052A | ||||
| JP6214738U | ||||
| JP6327048U | ||||
| JP57130442U |