Title:
【発明の名称】接続構造
Document Type and Number:
Japanese Patent JP2596960
Kind Code:
B2
Abstract:
A connection construction is provided for connecting a first conductor provided on a first member such as a semiconductor driving device to a second conductor provided on a second member such as a liquid crystal display device driven by the semiconductor driving device, the connection construction including a conductive adhesive deposited on the first conductor, a conductive particle bonded with the conductive adhesive and partly protruding toward the second conductor disposed opposite thereto, and an electrically insulating adhesive for bonding the first member to the second member with the conductive particle contacting the second conductor. The first conductor and the second conductor are electrically connected via the conductive particle, and the first member and the second member are mechanically connected with the electrically insulating adhesive. Thus, a semiconductor driving device (LSI) is, for example, directly connected to a transparent substrate of a liquid crystal display device. Also, when an electrically insulating adhesive is used for bonding the conductive particle, the conductive particle is bonded to contact the first conductor.
More Like This:
| WO/1998/027160 | THERMALLY REWORKABLE BINDERS FOR FLIP-CHIP DEVICES |
| WO/1996/036071 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE SUITABLE FOR SURFACE MOUNTING |
| JPS59106140 | SEMICONDUCTOR DEVICE |
Inventors:
Yasunobu Tabusa
Koji Matsubara
Takashi Nakai
Koji Matsubara
Takashi Nakai
Application Number:
JP5453788A
Publication Date:
April 02, 1997
Filing Date:
March 07, 1988
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L21/56; H01L21/60; H01L23/532; (IPC1-7): H01L21/60
Domestic Patent References:
| JP61207025A | ||||
| JP63136639A | ||||
| JP6237939U |
Attorney, Agent or Firm:
Umeda Masaru (2 outside)