Title:
【発明の名称】薄型パッケージ装置
Document Type and Number:
Japanese Patent JP2600898
Kind Code:
B2
Abstract:
PURPOSE:To improve moisture resistance as an IC and miniaturize the title item by allowing a recessed part to be formed at an element-mounting part and then using a substrate where leads are placed at the periphery of the recessed part as a base. CONSTITUTION:An element 7 is mounted to a recessed part 1a which is formed at the center on the surface of a substrate 1 and leads 2a, 2b, 2c, and 2d for leading to the outside are placed on the substrate 1 around the recessed part 1a. Then, the element 7 and the leads 2a, 2b, 2c, and 2d for leading to the outside are connected by leads 5a and 5b for connection. In this case, the element 7 at the surface side of the substrate 1, the leads for 5a and 5b for connection, and the leads 2a, 2b, 2c, and 2d for leading to the outside are covered with resin and the rear surface of the substrate 1 at a part where the recessed part 1a is formed is sealed without being covered with resin. Thus, the thickness of resin layer can be reduced for miniaturization and thinness by eliminating insulation resin layer at the stage rear surface side for mounting elements.
Inventors:
Rikuzono
Kazuhiko Mitobe
Kazuhiko Mitobe
Application Number:
JP9932789A
Publication Date:
April 16, 1997
Filing Date:
April 19, 1989
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L23/34; H01L21/60; H01L23/28; (IPC1-7): H01L23/28
Attorney, Agent or Firm:
Teiichi