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Patent Searching and Data


Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2602490
Kind Code:
B2
Inventors:
Petrus Martinus Albertus Wilhelms Morse
Theunis Hermanus Witttembohard
Application Number:
JP10825884A
Publication Date:
April 23, 1997
Filing Date:
May 28, 1984
Export Citation:
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Assignee:
Philips Electronics Nemrose Fennaught Shap
International Classes:
H01L29/73; H01L21/312; H01L21/331; H01L29/72; H01L29/732; (IPC1-7): H01L21/331; H01L21/312; H01L29/73
Domestic Patent References:
JP5335386A
JP5533074A
JP5771144A
JP56135966A
JP5680162A
JP57134966A
JP57124473A
JP5654067A
Attorney, Agent or Firm:
Akihide Sugimura (1 outside)