Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2602490
Kind Code:
B2
More Like This:
Inventors:
Petrus Martinus Albertus Wilhelms Morse
Theunis Hermanus Witttembohard
Theunis Hermanus Witttembohard
Application Number:
JP10825884A
Publication Date:
April 23, 1997
Filing Date:
May 28, 1984
Export Citation:
Assignee:
Philips Electronics Nemrose Fennaught Shap
International Classes:
H01L29/73; H01L21/312; H01L21/331; H01L29/72; H01L29/732; (IPC1-7): H01L21/331; H01L21/312; H01L29/73
Domestic Patent References:
JP5335386A | ||||
JP5533074A | ||||
JP5771144A | ||||
JP56135966A | ||||
JP5680162A | ||||
JP57134966A | ||||
JP57124473A | ||||
JP5654067A |
Attorney, Agent or Firm:
Akihide Sugimura (1 outside)