Title:
【発明の名称】半導体集積回路
Document Type and Number:
Japanese Patent JP2632512
Kind Code:
B2
Inventors:
YASUI IKUO
SHIMAZU YUKIHIKO
SHIMAZU YUKIHIKO
Application Number:
JP28516985A
Publication Date:
July 23, 1997
Filing Date:
December 18, 1985
Export Citation:
Assignee:
MITSUBISHI DENKI KK
International Classes:
H03K5/15; G06F1/06; H03K5/156; (IPC1-7): H03K5/15
Attorney, Agent or Firm:
Kaneo Miyata (3 outside)
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