Title:
【発明の名称】接着性を改良するための有機金属化合物を含有する強化ポリイミドフィルムの調製方法
Document Type and Number:
Japanese Patent JP2653725
Kind Code:
B2
Abstract:
A strengthened polyimide film is described, which has improved adhesion when bonded to a metal foil through a heat-resistant adhesive, containing from 0.02 to 1% by weight, based on the weight of the film, of an organo-metallic compound wherein the metal is tin, bismuth or antimony. A process for preparing a strengthened polyimide film is also described wherein an organometallic compound is introduced into a film-forming polyamic acid polymer prior to the casting step.
Inventors:
AADEYUENGO ANSONII JOOZEFU ZA SAADO
REI IIA CHIN
REI IIA CHIN
Application Number:
JP51249293A
Publication Date:
September 17, 1997
Filing Date:
December 30, 1992
Export Citation:
Assignee:
II AI DEYUHON DE NIMOASU ANDO CO
International Classes:
C08J5/18; C08J5/12; C08K5/56; C08K5/57; C08L79/08; H01B3/30; H05K1/03; (IPC1-7): C08J5/18; C08J5/12; C08K5/57; C08L79/08; H01B3/30
Domestic Patent References:
| JP4261466A | ||||
| JP62129352A | ||||
| JP61277922A |
Other References:
【文献】米国特許3389111(US,A)
Attorney, Agent or Firm:
Chika Takagi (2 outside)