Title:
【発明の名称】ワイヤボンディング装置並びにその方法
Document Type and Number:
Japanese Patent JP2657709
Kind Code:
B2
Abstract:
PURPOSE:To obtain an ideal ball press-bonding shape by providing a bonding arm provided at an end with a capillary, a driving arm for vertically oscillating the arm, and pressurizing force varying means for varying pressurized force at the time of bonding, and varying the pressure to be applied to the end of the capillary. CONSTITUTION:A ball 43a formed at the end of a wire 43 is sufficiently absorbed by a capillary 8 by a tension loading unit to approach a pad 45 arranged on an IC chip 44. In this case, only a driving arm 1 is continuously rotated in a direction Z by a vertically oscillating device to separate contacts 4 and 4', and the positional relationship between the arm 1 and a bonding arm 2 is deviated. The deviation is detected by a detector 9, and the apparatus is transferred by the detection output. Thereafter, voice coil units 5, 5' of pressurizing means are excited to generate a pressurizing force. The pressurizing force in the direction (b) is obtained by applying an ultrasonic wave in the direction of an arrow (a), pressurizing force in the direction of an arrow (b) and overheating means.
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Inventors:
TORIGOE TOSHIZO
Application Number:
JP12416990A
Publication Date:
September 24, 1997
Filing Date:
May 16, 1990
Export Citation:
Assignee:
KAIJOO KK
International Classes:
H01L21/607; H01L21/60; (IPC1-7): H01L21/60; H01L21/607
Domestic Patent References:
| JP62154748A | ||||
| JP58161334A | ||||
| JP61208836A | ||||
| JP62126647A | ||||
| JP613419A | ||||
| JP59152949U |
Attorney, Agent or Firm:
Shoji Hagiri